ChipAgents Raises $60M to Power Agentic AI for Chip Design
ChipAgents has raised an additional $60 million in Series A2 financing, expanding its Series A round to $134 million just six months after the...
Toshiba Ramps Up Compact Cortex-M4 MCUs for Single-Motor Control
Toshiba Electronic Devices & Storage Corporation has begun mass production of its TXZ+ Family Entry-Class M4L Group, a new series of compact motor-control microcontrollers...
U.S. Commerce Picks 7 Chip Firms for $874M in CHIPS R&D Bets
The U.S. Department of Commerce on July 29 signed letters of intent to steer $874 million in CHIPS Act incentives to seven companies working...
Design, Fab, Repeat – UoH Students Turn Internship into Real Devices
The Centre for Advanced Studies in Electronics Science and Technology (CASEST) at the School of Physics, University of Hyderabad, has concluded two intensive three-week...
Enphase Energy Publishes White Paper on Kestrel ASIC
Enphase Energy has released a new technical white paper detailing its latest custom silicon platform, the “Enphase Kestrel ASIC,” a purpose-built chip designed to...
Tessolve Ties Up with Intel Foundry for Advanced EMIB Packaging
Tessolve has partnered with Intel Foundry to support advanced package design like EMIB chiplet packaging. Embedded Multi-die Interconnect Bridge (EMIB) has become a key technology...