ELCINA EMC Bhiwadi Targets 2,700 Jobs with ESSCI-Led Training Initiatives
As India accelerates its push to become a global electronics and semiconductor manufacturing hub, building a skilled workforce is becoming just as critical as...
Fujifilm Debuts PFAS-Free PBO for Semiconductor Packaging at ECTC 2026
FUJIFILM Corporation announced it will unveil new semiconductor packaging research findings and showcase its ZEMATES™ product line of photosensitive insulating materials including PFAS-free PBO...
Entegris and Inpria Cross-License EUV Lithography Patents
Entegris and JSR Corporation, the materials innovation company and parent of Inpria Corporation, have announced a non-exclusive cross-licensing agreement designed to help the semiconductor...
Microchip’s 3.3kV mSiC Modules Power Next-Gen AI Data Centers
Microchip Technology just unveiled its new 3.3 kV HV-D3 mSiC power modules, a game-changer for solid-state transformers (SSTs) in AI hyperscale data centers and...
HMS Anybus Communicators Become CRA-Ready for EU Cybersecurity
HMS Networks just made life a lot easier for industrial manufacturers dealing with the EU Cyber Resilience Act (CRA). Its Anybus Communicators are now...
MIKROE Debuts Stepper 29 Click for Smarter, Smoother Motor Control
Stepper 29 Click is MIKROE’s latest addition to its lineup of motor control Click boards, designed to simplify and accelerate embedded development. Built for...