STMicroelectronics has kicked off high-volume production of its advanced PIC100 silicon photonics platform, just as hyperscalers race to meet exploding AI infrastructure demands.
The 300mm ST’s PIC100 platform powers 800G and 1.6T transceivers that deliver higher bandwidth, lower latency, and better energy efficiency for data center optical interconnects and AI clusters.
Coming next is the ST’s PIC100 TSV roadmap, integrating through-silicon via technology to pack even more optical density, module integration, and thermal efficiency into future Near Packaged Optics (NPO) and co-packaged optics (CPO).
With best-in-class waveguide losses (0.4 dB/cm silicon, 0.5 dB/cm silicon nitride), advanced modulators, photodiodes, and edge coupling, ST’s platform is perfectly timed for hyperscalers pushing toward deeper optical-electronic integration.
Leadership Comments
“Following the announcement of its new silicon photonics technology in February 2025, ST is now entering high-volume production for leading hyperscalers. The combination of our technology platform and the superior scale of our 300 mm manufacturing lines gives us a unique competitive advantage to support the AI infrastructure super-cycle,” said Fabio 
Gualandris, President, Quality, Manufacturing & Technology, STMicroelectronics. “Looking ahead, we are planning and executing on capacity expansions to enable more than quadrupling of production by 2027. This fast expansion is fully underpinned by customers’ long-term capacity reservation commitments.”
“The data center pluggable optics market continues to expand strongly, reaching $15.5 billion in 2025. We expect the market to grow at a compound annual growth rate (CAGR) of 17% from 2025 through 2030, surpassing $34 billion by the end of the forecast period. In addition, co-packaged optics (CPO) will emerge as a rapidly growing segment, contributing more than $9 billion in revenue by 2030. Over the same period, the share of transceivers incorporating silicon photonics modulators is projected to increase from 43% in 2025 to 76% by 2030,” said Dr. Vladimir Kozlov, CEO and Chief Analyst at LightCounting.
“ST’s leading silicon photonics platform coupled with its aggressive capacity expansion plan illustrates its capabilities to provide hyperscalers with secure, long-term supply, predictable quality, and manufacturing resilience,” added Dr. Vladimir.
ST at OFC 2026
ST will discuss business and technology roadmap updates at the upcoming Optical Fiber Communication Conference® (March 15-19th), Los Angeles, USA:
- paper titled “An Innovative 300mm Back Side Integrated Silicon Photonics Platform for 200Gbits/lane Applications”
- First PIC100-based demo of a 1.6T-DR8 silicon photonics transceiver, engine by Sicoya and STMicroelectronics. See it on the Sicoya booth #507
- Participation to the CEA-Leti event: “Optical Interconnects: Driving Innovation in AI Factory and Beyond” (March 18, 6-8pm PT)
