THine Electronics has introduced a groundbreaking optical DSP-free chipset featuring its proprietary ZERO EYE SKEW technology, targeting short-reach optical links in PCI Express 7 (PCIe7) systems.
This innovation supports 2TB/s linear pluggable optics (LPO) and co-packaged optics (CPO), slashing power use by 73% while cutting latency by 90%.
Designed for scale-up AI networks, the chipset enables “slow and wide” interconnections that bypass traditional optical DSPs. This delivers a cost-efficient, low-latency, high-density solution ideal for next-gen data centers.
THine will offer samples of VCSEL drivers and transport amplifiers (TIAs) for PCIe7 in 2027, with PCIe6 versions available in 2026. Additionally, the company plans to release samples of its Sideband Aggregator IC in 2026.
The VCSEL drivers and TIAs were developed under a grant (No. JPJ012368G70601) from Japan’s National Institute of Information and Communications Technology (NICT).
THine’s Sideband Aggregator IC (THCS255) tackles the challenge of multiple GPIO sideband lines in PCIe6/7 setups, halving or further reducing them through advanced high-speed serial tech for streamlined connectivity.
THine will showcase this solution at OFC 2026, held March 17-19 at the Los Angeles Convention Center (West Hall 4575).
Key Comment
“The adoption of artificial intelligence(AI) is rapidly expanding. Since AI servers are going to be equipped with over 500 GPUs and memories, we are confident that THine’s proprietary ZERO EYE SKEW® technology, eliminating DSPs from optical links in Scale-Up AI networks, delivers significant value of efficient costs, lower latency, high-density, and lower power,” said Yasuhiro Takada, Chief Strategy Officer of THine Electronics, Inc. “THine plans to accelerate product development and to contribute to ‘slow and wide’ optical interconnection through collaboration and cooperation with major global customers, hyperscalers, and partners.”
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