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Will TI’s New Direct Imaging Tech Define Maskless Digital Lithography

The DLP991UUV digital micromirror device (DMD), Texas Instruments (TI) highest resolution direct imaging technology to date, is advancing the next phase of maskless digital lithography.

For maskless digital lithography New TI DLP991UUV DMD
Caption: TI’s DLP® technology enables maskless digital lithography systems for advanced packaging.

With its 8.9 million pixels, sub-micron resolution, and 110 gigapixels per second data rate, the device provides the scalability, affordability, and accuracy required for increasingly complex packaging without requiring costly mask technology.

Manufacturers of system assembly equipment can use TI DLP technology to use maskless digital lithography to print at high resolutions at scale, which is required for sophisticated packaging.

As a programmable photomask, the new DLP991UUV provides reliable high-speed performance together with accurate pixel control.

The DLP991UUV is the latest and leading device of TI’s direct imaging portfolio. Key features of the device include:  

  • Highest resolution in the portfolio, offering more than 8.9 Megapixels
  • Fastest processing speed of up to 110 Gigapixels per second
  • Power levels of 22.5W/cm² at 405nm
  • Ability to operate at wavelengths as low as 343nm
  • Smallest mirror pitch in the portfolio of 5.4um

Texas Instruments DLP technology provides cutting-edge light control and high-resolution displays by utilizing the power of millions of microscopic mirrors. Applications for the technology include high-precision lithography and machine vision systems for next-generation industrial manufacturing, intelligent automotive lighting for improved road safety, and the projection of stunning 4K video in home theaters.

Advanced packaging is increasingly being produced using maskless digital lithography machines, which project light to etch circuit designs on materials without the need for a photomask or expensive stencil.

By integrating several circuits and technologies into one package, advanced packaging makes it possible for high-computing applications—like data centers and 5G—to have quicker, smaller, and more power-efficient systems.

Availability

Preproduction quantities of the new DLP991UUV DMD are available for purchase now on TI.com. Multiple payment and shipping options are available. 

For maskless digital lithography New TI DLP991UUV DMD
Caption: TI’s DLP® technology enables maskless digital lithography systems for advanced packaging.

Leadership Comments 

“Just as we redefined cinema by enabling the transition from film to digital projection, TI’s DLP technology is once again at the forefront of a major industry shift,” said Jeff Marsh, vice president and general manager of DLP technology at TI. “We’re enabling the creation of maskless digital lithography systems that empower engineers around the world to breakthrough the current limits of advanced packaging and bring powerful computing solutions to market.”

To Know More, Read The Company Blog, “Beyond the mask: How DLP® technology is enabling new computing solutions with advanced packaging.”

VOLT TEAM
VOLT TEAMhttps://thevoltpost.com/
The Volt Team is The Volt Post’s internal Editorial and Social Media Team. Primarily the team’s stint is to track the current development of the Tech B2B ecosystem. It is also responsible for checking the pulse of the emerging tech sectors and featuring real-time News, Views and Vantages.

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