LG Chem has announced a significant breakthrough in semiconductor materials with the successful development of proprietary liquid photo-imageable dielectric (PID) technology and ongoing progress in film-type PID tailored for integrated circuit (IC) substrates.
This development positions LG Chem as a key supplier addressing the rising demand for advanced semiconductor packaging solutions driven by rapid growth in artificial intelligence (AI) and high-performance semiconductor markets.
Photo-imageable dielectrics, or PIDs, are critical photosensitive materials used to create ultra-fine interconnects between semiconductor chips and substrates, directly impacting circuit fidelity, device reliability, and overall functionality in advanced packaging processes.
As semiconductor devices become increasingly miniaturized and feature denser circuitry, high-resolution PID technology has emerged as an essential enabler for meeting stringent electrical and mechanical performance benchmarks.
LG Chem’s newly developed liquid PID stands out with its high-resolution patterning capabilities, low-temperature curing process, and low shrinkage characteristics. These attributes contribute to enhanced manufacturing process stability and improved moisture resistance, which are paramount in ensuring the durability and operational stability of semiconductor devices.
Notably, LG Chem has engineered this liquid PID to be environmentally responsible by eliminating the use of per- and polyfluoroalkyl substances (PFAS) and avoiding harmful organic solvents such as N-methyl-2-pyrrolidone (NMP) and toluene. This is a critical advancement amid rising global regulatory pressures on semiconductor supply chain materials.
Beyond liquid PID, LG Chem is advancing the development of film-type PID specifically designed for larger IC substrates with demanding panel uniformity and thermal reliability requirements.
Traditional liquid PIDs face challenges in maintaining uniform coating thickness and controlling thermal expansion mismatches that lead to cracking, especially when applied double-sided over large substrate panels.
LG Chem’s film PID, supplied as a precisely controllable attachable film, addresses these issues by ensuring uniform thickness and high pattern fidelity across extensive substrate areas.
Its superior mechanical properties, including strength, elasticity, and low moisture absorption, significantly reduce the risk of cracking under repeated thermal cycling conditions typical of semiconductor manufacturing.
An important highlight of LG Chem’s film PID is its compatibility with existing lamination equipment, allowing substrate manufacturers to adopt this new material without major process overhauls.
This seamless integration capability is expected to accelerate industry adoption and provide substrate manufacturers with a robust, high-performance option to meet evolving market requirements.
LG Chem is actively collaborating with leading global semiconductor firms in joint development programs, aimed at refining and accelerating the commercial adoption of both liquid and film PID solutions.
These partnerships underscore LG Chem’s commitment to expanding its influence in the semiconductor packaging materials ecosystem and challenging the dominance of traditional Japanese suppliers who have long led in this space.
Leadership Comment
Shin Hak-cheol, CEO of LG Chem, commented on the company’s strategic initiatives, “We are proactively addressing our customers’ needs for advanced packaging innovation across a broad materials portfolio. Our approach goes beyond simple material supply; we aim to shape new industry trends in close collaboration with our customers. By leveraging our proprietary technologies and sustainable product design, we are helping semiconductor manufacturers meet the challenges of next-generation device integration and performance.”
In addition to its pioneering PID developments, LG Chem is ramping up production and innovation in other critical back-end semiconductor materials, including Copper-Clad Laminates (CCL), Die Attach Film (DAF), Non-Conductive Film (NCF), and Build-Up Film (BUF).
These efforts consolidate LG Chem’s role as a comprehensive supplier of materials essential for advanced semiconductor packaging and high-performance electronics, further reinforcing its position as a vital player in the global semiconductor materials supply chain.
