Announcing the launch of their industrial-grade embedded MultiMediaCard (eMMC) module is Teledyne HiRel Semiconductors. With 128GB of eMMC 5.1-compatible storage in a small 153-ball FBGA package, this device is designed to provide dependable, fast performance even in challenging conditions.
This eMMC module is ideal for embedded applications in aerospace, defense, industrial automation, and ruggedized edge computing because it is qualified over the industrial temperature range of -40°C to +85°C. Its inbuilt controller manages error correction (ECC), wear leveling, and bad block management, guaranteeing long-term data integrity and streamlining system integration.
The module is currently available, runs from a single 3.3V supply (I/O @ 1.8V), supports JEDEC-standard eMMC 5.1 instructions, and provides consistent read/write speeds appropriate for OS boot, data logging, and code storage.
Its extended availability aids in maintaining support and continuity during multi-year program lifecycles.
Leadership Comments
“With eMMC continuing to serve as a foundational technology for embedded systems, we’re proud to offer a drop-in solution with long-term supply assurance and robust performance,” said Mont Taylor, Vice President of Business Development at Teledyne HiRel. “This release supports our customers’ demand for reliable, off-the-shelf storage solutions that integrate easily into space-constrained, mission-critical systems.”
For more information on this device, CLICK HERE | To explore Teledyne HiRel’s full portfolio of semiconductors, converters, processors, and related services, CLICK HERE
