Visteon EV powertrain applications using Infineon CoolGaN (Gallium Nitride) and CoolSiC (Silicon Carbide) devices will include battery junction boxes, DC-DC converters, and on-board chargers. The resulting powertrain systems will be the most efficient, robustness, and reliability.
Infineon Technologies and Visteon Corporation announced that they have signed a Memorandum of Understanding (MOU) to accelerate the development of next-generation electric vehicle powertrains.
In this joint effort, Infineon and Visteon will collaborate and integrate power conversion devices based on Infineon semiconductors, with a focus on wideband gap device technologies, which offer significant advantages in power conversion applications over silicon-based semiconductors.
These devices have higher power density, efficiency, and thermal performance, which helps to enhance efficiency and lower system costs for next-generation power conversion modules for the automobile industry.
Visteon EV powertrain applications using Infineon CoolGaN (Gallium Nitride) and CoolSiC (Silicon Carbide) devices will include battery junction boxes, DC-DC converters, and on-board chargers. The resulting powertrain systems will be the most efficient, robustness, and reliability.
Leadership Comments
“Working with Infineon allows us to integrate cutting-edge semiconductor technologies that are essential in improving power conversion efficiency and overall system capability of next generation electric vehicles,” said Dr. Tao Wang, Head of the Electrification Product Line of Visteon Corporation. “This collaboration will advance technologies that accelerate the transition to a more sustainable and efficient mobility ecosystem.”
“Visteon is a recognized innovator and an early adopter of new technologies, making them an ideal partner for us,” said Peter Schaefer, Chief Sales Officer Automotive, Infineon Technologies AG. “Together, we will push the boundaries of electric vehicle technology and provide superior solutions to the global automotive industry.”
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