Infineon Technologies has launched a new generation of products to meet the growing demand for high-voltage automotive IGBT chips. These products include the EDT3 (Electric Drive Train, 3rd generation) chips, which are built for 400 V and 800 V systems, as well as the RC-IGBT chips, which are specifically developed for 800 V systems. These devices improve the performance of electric drivetrain systems, making them ideal for automotive applications.
The EDT3 and RC-IGBT Bare Dies Have Been Engineered To Deliver:
- High-quality and reliable performance, empowering customers to create custom power modules.
- New generation EDT3 represents a significant advancement over the EDT2, achieving up to 20 percent lower total losses at high loads while maintaining efficiency at low loads.
- This achievement is due to optimizations that minimize chip losses and increase the maximum junction temperature, balancing high-load performance and low-load efficiency.
- Electric vehicles using EDT3 chips achieve an extended range and reduce energy consumption, providing a more sustainable and cost-effective driving experience.
The EDT3 Chipsets, Which Are Available in 750 V and 1200 V Classes, Deliver:
- Reduced chip size and optimized design facilitate the creation of smaller modules, consequently leading to lower overall system costs.
- Maximum virtual junction temperature of 185°C and a maximum collector-emitter voltage rating of up to 750 V and 1200 V.
- Well-suited for high-performance applications, enabling automakers to design more efficient and reliable powertrains that can help extend driving range and reduce emissions.
The 1200 V RC-IGBT improves performance by combining IGBT and diode functionalities onto a single die, resulting in an even higher current density than separate IGBT and diode chipset solutions. This innovation results in a system cost savings due to higher current density, scalable chip size, and reduced assembly effort.
The HybridPACK™ Drive G2 automotive power module now features Infineon’s latest EDT3 IGBT chip technology, resulting in improved performance and capabilities across the range.
This module has a power range of up to 250 kW in the 750 V and 1200 V classes, improved ease of use, and new features including an integration option for next-generation phase current sensors and on-chip temperature measurement, which contribute to system cost savings.
All chip devices come with customized chip layouts, which include on-chip temperature and current sensors. Additional metallization choices for sintering, soldering, and bonding are available upon request.
Leadership Comments
“Infineon, as a leading provider of IGBT technology, is committed to delivering outstanding performance and reliability”, says Robert Hermann, Vice President for Automotive High Voltage Chips and Discretes at Infineon Technologies. “Leveraging our steadfast dedication to innovation and decarbonization, our EDT3 solution enables our customers to attain ideal results in their applications.”
“Infineon, as Leadrive’s primary IGBT chip supplier and partner, consistently provides us with innovative solutions that deliver system-level benefits,” said Dr. Ing. Jie Shen, Founder and General Manager of Leadrive. “The latest EDT3 chips have optimized losses and loss distribution, support higher operating temperatures, and offer multiple metallization options. These features not only reduce the silicon area per ampere, but also accelerate the adoption of advanced packaging technologies.”
Applications
High output current, making them well-suited for main inverter applications in a diverse range of electric vehicles, including battery electric vehicles, plug-in hybrid electric vehicles, and range-extended electric vehicles (REEVs).
Availability
The new EDT3 and RC-IGBT devices are already available for sampling. Further information is available at www.infineon.com/edt3.
BEVs, PHEVs Driving EV Market
The electric vehicle market is expanding rapidly, with substantial volume growth in both battery electric vehicles (BEVs) and plug-in hybrid electric cars (PHEVs). The share of electric vehicles manufactured is predicted to climb by double digits by 2030, reaching roughly 45 percent from 20 percent in 2024 [1] Infineon estimates
