POWER ELECTRONICS
onsemi Unveils Industry-First SiC Pairing Studio for Faster Power Design
onsemi has introduced the Elite Pairing Studio, an online design environment built to simplify how engineers match silicon carbide (SiC) MOSFETs with gate drivers...
ROHM Launches Compact 80V MOSFETs for 48V Automotive Systems
ROHM has introduced the AG16xFNxx Series, a new lineup of 80V power MOSFETs designed for 48V power supply systems, which are becoming increasingly common in...
Littelfuse Unveils 14kA SMD Fuse for 48V AI Power Systems
Littelfuse has introduced the NANO2 Surface-Mount 708 Series Fuse, marking its first surface-mount fuse to deliver a 14,000 A interrupting rating at 80 VDC.
Built...
Microchip Targets GNSS Resilience with TimePictra 12 Launch
Microchip Technology has introduced the TimePictra® 12 platform, a major upgrade to its synchronization management software aimed at giving critical infrastructure operators greater visibility, control,...
Wolfspeed Gen 5 SiC Technology Crushes EV Efficiency Barriers
Gen 5 SiC MOSFETs carries forward the same body diode from the Gen 4 platform but pushes the continuous junction temperature to 200? (215?...
A New Standard Power Module Package Built For 3-Level Circuits
Mitsubishi Electric and Semikron Danfoss have jointly developed a new standard power module package built for 3-level circuits, targeting industrial drives and renewable energy...
Frenetic Electronics Solves Real Magnetic Design Challenges with New Tools
Frenetic Electronics announces new features that actually solve the magnetic challenges its customers face. No guesswork, just industry-driven solutions launches new planar magnetics design...
Bosch’s Gen 3 SiC Chips Bring 20% EV Performance Boost to India
Gen 3 SiC enables compact, efficient power electronics by cutting energy losses, improving thermal performance, and reducing system complexity and cooling needs.
India's electric mobility...
ROHM’s New SiC Package Enables Automated Mounting for EV Power Systems
ROHM has cracked a major challenge in power electronics with its new TSC3PAK package (14.00 × 18.58 × 3.50mm) for SiC MOSFETs. By flipping the heat...
Omron offer for the e-mobility industry
EV Charging Stations are sprouting up like mushrooms after the rain, and increasingly modern models of "electric cars" are powered by energy-efficient and increasingly...
KYOCERA AVX at IMS 2026 – RF/Microwave Innovations for 5G and Defense
KYOCERA AVX is exhibiting at IMS 2026, the IEEE International Microwave Theory Symposia, this week in Boston, running from Sunday, June 7, through Friday,...