ELECTRONICS
Microchip Clears Major Radiation Tests with New RISC V Space Processor
As spacecraft become increasingly autonomous, software-defined, and incredibly data-heavy, the demand for serious onboard processing is skyrocketing. However, that computing power has to survive...
Same Sky Adds 18 Reflow Solder Compatible MEMS Microphones to Audio Lineup
Same Sky and its Audio Group announced the introduction of 18 new models to its MEMS microphones product offering. The CMM family is housed...
Panasonic Targets Noise-Sensitive Design with New Silent EVP-BX Tactile Switch
Panasonic has rounded out its 6.0mm x 6.0mm SMD tactile switch lineup with the new EVP-BX, a quiet-type switch engineered specifically for noise-sensitive designs....
ST Debuts First Automotive Safety Sensors Following NXP MEMS Acquisition
STMicroelectronics has announced a set of automotive sensors that enable vehicle brands to extend advanced safety and driver-assistance features across categories from premium to...
Littelfuse Launches 7 kW Automotive TVS Diodes With Ultra-Low Clamping
Littelfuse has introduced the TP7.0SMD-XC Series of automotive-grade TVS diodes, led by the TP7.0SMD24CA-XC. Built around advanced foldback technology, the series delivers an unusually...
Power Integrations Expands Billion-Unit CAPZero Line with Ultra-Low Power IC
Power Integrations just rolled out the CAPZero-4, the latest addition to their well-known line of X-capacitor discharge ICs. They actually pioneered this technology back...
VW and NXP Forge Strategic Zonal MCU Pact for 2027 SDVs
Ahead of the International Suppliers Fair (IZB) in Wolfsburg, Volkswagen Group and NXP Semiconductors have forged a strategic partnership that lays the physical groundwork...
Automotive Noise Suppression – The Silent Shift in EVs
The automotive industry is currently undergoing a massive paradigm shift. The gentle hum of electric traction motors is rapidly replacing the traditional mechanical roar...
Rambus, ChipAgents Accelerate Chip Design with Agentic AI
Rambus and ChipAgents are teaming up to push the boundaries of chip design using agentic AI. The partnership is comprehensive as Rambus is rolling...
Navitas Unveils 2300V SiC Modules to Power Next-Gen AI, Grid Infrastructure
Navitas Semiconductor is expanding its ultra-high-voltage (UHV) SiC portfolio with a new line of power modules built specifically to handle the heavy demands of...
HMS Networks to Host Virtual Engineering Day on CAN XL and Automotive Ethernet
HMS Networks is dedicating October 28 to the nuts and bolts of modern automotive networking with its virtual In-vehicle Communication Engineering Day.
Aimed directly at...
