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TVP BUREAU

TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

Vertical Semiconductor Lands $73M in CHIPS Act Funding

Vertical Semiconductor is gearing up for a massive leap...

Navitas Unveils 2300V SiC Modules to Power Next-Gen AI, Grid Infrastructure

Navitas Semiconductor is expanding its ultra-high-voltage (UHV) SiC portfolio...

HMS Networks to Host Virtual Engineering Day on CAN XL and Automotive Ethernet

HMS Networks is dedicating October 28 to the nuts...

Microchip Expands L-Series with 50-krad Rad-Tolerant, Ultra-Compact LX-820 Oscillator

Microchip Technology has expanded its L-Series timing lineup with...

Inertial Labs Launches NVIDIA-Powered INS-NV Navigation Platform

Inertial Labs, a VIAVI company, has launched the INS-NV,...

Matching Signal and Power Connectors to Robotic and Other High-Density Industrial Applications

- Barley Li, Applications Engineering Manager – Technical Content,...

eSIM Index 2026 – US at 90.2, Markets Lag Behind

Holafly launched the new Holafly Global eSIM Index 2026 - the first study of its kind to assess how ready 50 markets and 171 mobile...

Marelli Guangzhou Plant Turns 30, Becomes Global Hub

Marelli Guangzhou Plant (China) is marking 30 years of its electronics manufacturing plant. The company in its official release asserts it be a milestone...

ELCINA EMC Bhiwadi Targets 2,700 Jobs with ESSCI-Led Training Initiatives

As India accelerates its push to become a global electronics and semiconductor manufacturing hub, building a skilled workforce is becoming just as critical as...

Fujifilm Debuts PFAS-Free PBO for Semiconductor Packaging at ECTC 2026

FUJIFILM Corporation announced it will unveil new semiconductor packaging research findings and showcase its ZEMATESâ„¢ product line of photosensitive insulating materials including PFAS-free PBO...

Entegris and Inpria Cross-License EUV Lithography Patents

Entegris and JSR Corporation, the materials innovation company and parent of Inpria Corporation, have announced a non-exclusive cross-licensing agreement designed to help the semiconductor...

Microchip’s 3.3kV mSiC Modules Power Next-Gen AI Data Centers

Microchip Technology just unveiled its new 3.3 kV HV-D3 mSiC power modules, a game-changer for solid-state transformers (SSTs) in AI hyperscale data centers and...

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