Motorola Expands Counter-UAS Portfolio with D-Fend Buyout
Motorola Solutions has signed a definitive agreement to acquire counter-drone specialist D-Fend Solutions for $1.5 billion. The move brings in a company with a...
Danisense current measurement solutions at PCIM
Danisense will showcase its latest current measurement solutions at PCIM Expo 2026 in Nuremberg, Germany, from June 9 to 11, at Hall 7, Stand...
3D Silicon Chip Breakthrough Could Keep Moore’s Law Alive
The team, led by materials science and engineering professor Qing Cao, developed a process that uses ultrathin silicon membranes and low-temperature manufacturing to overcome...
AVILOO Launches Data-Backed EV Battery Warranty in France and Sweden
AVILOO's new EV Battery Warranty is reshaping how used electric vehicles are evaluated and sold. For the first time, an independent battery diagnosis is...
MediaTek Backs TSMC, Intel Advanced Packaging – What It Means?
MediaTek has signaled that it will support advanced chip packaging from both TSMC and Intel, a move that gives customers more flexibility as demand...
Honeywell Unveils Aerospace Spin-Off as HONA, Sets Dual-Company Future
Honeywell has unveiled new brand identities for its automation and aerospace businesses - Honeywell Technologies and Honeywell Aerospace, ahead of their separation into two...