TYLsemi Raises $43M to Scale Chiplet Platform for AI Infrastructure
TYLsemi™ has emerged from stealth with an oversubscribed $43 million early-stage funding round, positioning itself to accelerate the next wave of AI infrastructure built...
Siemens Energy Reboots Its Identity as Omterra
Siemens Energy is preparing to retire the Siemens name and step out under its own global brand identity Omterra, unifying its conventional and renewable...
From SiC to Metrology, Europe Fuels a New German Chip Cluster
The approvals mark the 15th to 18th state aid decisions under the EU Chips Act framework, bringing total funding from earlier measures to around...
Can MCUs Think in Prompts?
Earlier Ensemble generations were aimed primarily at classic edge AI workloads such as vision, audio and sensor analytics. By contrast, the new GenAI family...
VectorBlox 3.0 Puts Low-Power AI Inference on a Flight Path to Space
Deploying AI inference into power constrained, mission critical environments like aerospace and defense systems demands a careful balance of performance, efficiency, reliability and development...
Huawei, Baidu Front China’s Bid to Standardize Near Packaged Optics
Huawei, Baidu and more than 20 partners have launched the OPEN NPO project, rolling out China’s first near packaged optics NPO optical interconnect multi...