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TVP BUREAU

TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

Teledyne FLIR Secures Industry-First UL 2684 Listing for Thermal Fire Detection Cameras

Teledyne FLIR has landed an industry-first UL 2684 listing...

Renesas Debuts Industry-First Dual-Side Cooled 650V GaN

Renesas Tackles AI Data Center Heat with Industry-First Dual-Side...

Kosuke Akiyoshi Tapped to Lead Panasonic Industry Europe as Spatz Retires

Panasonic Industry Europe is undergoing a major leadership transition....

BOS Semiconductors Joins Arm Ecosystem to Scale Custom Silicon for Physical AI

BOS Semiconductors has joined the Arm Total Design for...

NX Group with ISM to Overhaul India’s Chip Supply Chain Logistics

IPPON EXPRESS HOLDINGS, INC. signed a memorandum of understanding...

Navitas Lands ALATTIS Contract to Bridge Critical U.S. Supply Gap in 10 kV SiC Tech

With the ALATTIS program underway, Navitas will now build...

Everspin, Teledyne HiRel to Expand MRAM in Aerospace and Defence Systems

Everspin Technologies and Teledyne HiRel Semiconductors have entered into a strategic partnership aimed at accelerating the adoption of Everspin’s magnetoresistive random-access memory (MRAM) in...

Murata Brings the Future of Electronics at electronica India 2026

Murata at electronica India 2026 will showcase its latest electronic technologies and application solutions. The event is scheduled to take place from 16 to...

izmo Microsystems Develops India-Made 40 GHz RF QFN Package

IZMO Limited’s semiconductor subsidiary, izmo Microsystems, has developed a high-frequency RF QFN Package designed for semiconductor devices operating at frequencies of up to 40...

Wizerr AI Expands Component Intelligence Engine to Manufacturers

Wizerr AI is expanding its ELX component intelligence engine to component manufacturers, giving FAE and sales engineering teams access to Engineering AI that can...

LUBIS Expands Bengaluru Team to Drive Formal Verification Growth

LUBIS is expanding its engineering presence in India, tapping into the country’s strong talent pool across semiconductor engineering, electronic design automation (EDA), and software. The...

NVIDIA and MediaTek Deepen Collaboration on AI Computing

NVIDIA and MediaTek are expanding their long-standing collaboration across AI infrastructure, local AI computing and automotive platforms, bringing together NVIDIA’s accelerated computing and AI...

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