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TVP BUREAU

TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

Wi-SUN FAN Ratified as First ISO/IEC Wireless Mesh Networking Standard

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The Wi-SUN Alliance has announced that its Field Area...

Polymatech Commissions Sapphire Crystal-Growth Puller at Oragadam

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Polymatech Electronics has commissioned a sapphire ingot crystal-growth puller...

Danisense Appoints Hjalti Pall Thorvardarson as COO to Drive Global Growth

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Danisense has appointed Hjalti Pall Thorvardarson as Chief Operating...

Gyre Energy Raises $1.3Mn for AI-Driven Cooling

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Gyre Energy has secured more than $1.3 million in...

AI Servers Are Driving High-End MLCCs Toward a Looming Shortage

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AI servers are now the main engine behind a...

Deepa Salvan Joins Tata Electronics to Steer High-Stakes Strategic Deals

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Tata Electronics has appointed seasoned international finance leader Deepa...
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Qorvo Targets Advanced AESA Systems with New X Band Module

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Qorvo has introduced a new X band radar front end solution designed to help defense system engineers push performance further without adding size, weight,...
ELECTRONICS

A New Standard Power Module Package Built For 3-Level Circuits

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Mitsubishi Electric and Semikron Danfoss have jointly developed a new standard power module package built for 3-level circuits, targeting industrial drives and renewable energy...
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Teradyne and TEL Launch KGD Test Cell for AI Chips

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Integrated KGD Test Cell, UltraFLEXplus with Prexa SDP for AI, data center 2.5D/3D package manufacturing yield. Teradyne and Tokyo Electron (TEL) to deliver an integrated...
ELECTRONICS

NXP’S New Radar SoC Democratizes Advanced ADAS for EVs

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NXP Semiconductors announced the SAF8444, a new Automotive Radar SoC with an innovative RF design that delivers high performance while keeping power consumption low. This...
ELECTRONICS

MIKROE Spatial Anchor S1 R1 Trackers Enable 6-DoF Motion for Apple Vision Pro

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MIKROE announces two spatial accessory tracking modules that mount to simulation rigs, industrial equipment, and basically anything you want Apple Vision Pro to track...
INDUSTRY PICKS

ICMC 2026 Brings Semiconductor Modeling Experts to Long Beach

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Less than two months before the 2026 International Compact Modeling Conference - (ICMC 2026), the Si2 Compact Model Coalition backed by IEEE and the...
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