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TVP BUREAU

TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

Pickering Applies Partial Discharge Testing to High-Voltage Relays

Pickering Electronics is upgrading its high-voltage relay portfolio by...

R&S FNH Handheld Combi Analyzer to Replace Legacy Models

Rohde & Schwarz has introduced the R&S FNH handheld...

MacDermid Alpha’s Dr. Ravi Bhatkal Honored for Establishing Production-Grade SMT Line

Dr. Ravi Bhatkal, Vice President of Strategy (India) at...

VNRVJIET Wraps ICMACC 2026 Focus on Deep Tech and Robotics

The 3-day International Conference on Recent Trends in Microelectronics,...

ST Unveils Unified STM32 Platform and New Automotive-Grade MCUs

STMicroelectronics is making a major move to unify its...

TI Integrates Agentic AI into CCStudio to Automate Embedded Code Migration

Texas Instruments is taking embedded software development a step...

TakeMe2Space Launches Orbital AI Infrastructure with SpaceX Rideshare Mission

TakeMe2Space is getting ready to deploy its MOI-1A satellite aboard SpaceX’s Transporter-18 rideshare mission on October 2, moving edge computing straight into Earth's orbit. Equipped...

Broadcom-Toppan JV Opens Singapore Fab to Clear AI Substrate Bottlenecks

In a targeted strike against the production bottlenecks stalling the artificial intelligence sector, US chipmaker Broadcom and Japanese manufacturing giant Toppan Holdings have launched...

Teledyne FLIR Secures Industry-First UL 2684 Listing for Thermal Fire Detection Cameras

Teledyne FLIR has landed an industry-first UL 2684 listing for its A40 and A70 (Axx-Series) thermal imaging cameras, officially clearing the hardware for use...

BOS Semiconductors Joins Arm Ecosystem to Scale Custom Silicon for Physical AI

BOS Semiconductors has joined the Arm Total Design for Physical AI ecosystem. Through its participation, BOS Semiconductors plans to expand its technology and business...

Resonac Targets 4x Die Yield Boost with Ultra-Large Wafer Format

The two-decade reign of the 300mm silicon wafer might be coming to an abrupt end, and Japan is positioning itself to own the next...

Pickering Launches Modular 65-217 Matrix to Simplify Complex Test Systems

Pickering Interfaces Rolls Out Modular 65-217 LXI Matrix to Simplify Scalable Test Systems. Test engineers dealing with constantly shifting system requirements just got a new...

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