Microchip Technology has introduced its new BZPACK mSiC power modules, engineered to deliver robust performance even in the toughest conditions. Designed to meet High Humidity High Voltage High Temperature Reverse Bias (HV-H3TRB) standards that go well beyond the typical 1,000-hour benchmark, these modules offer exceptional reliability for industrial and renewable energy systems.
With a Comparative Tracking Index (CTI) of 600V, stable Rds(on) across temperature ranges, and substrate options in Aluminum Oxide (Al2O3) or Aluminum Nitride (AlN), the BZPACK series ensures outstanding insulation, efficient thermal management, and long-term durability.
To simplify system design and manufacturing, the modules feature a compact, baseplate?less construction with Press?Fit, solder?free terminals and an optional pre?applied Thermal Interface Material (TIM).
These features not only speed up assembly but also improve consistency and make multi-sourcing easier through industry-standard footprints.
Designers can choose from various topologies including half-bridge, full-bridge, three-phase, and PIM/CIB configurations to best match their system architecture, performance goals, and cost targets.
Microchip’s MB and MC families of mSiC MOSFETs complement these modules, offering robust performance for both industrial and automotive applications. Many options are AEC-Q101 qualified, support VGS ? 15V, and come in standard packages for straightforward integration.
The MC family further enhances switching performance with an integrated gate resistor, enabling lower switching energy and improved stability in multi?die setups. Devices are currently available in TO-247-4 Notch and waffle-pack die formats.
Backed by more than two decades of experience in SiC technology, Microchip continues to help customers accelerate SiC adoption with solutions that reduce system cost, speed up development, and lower design risk.
Leadership Comment
“The launch of our BZPACK mSiC power modules reinforces Microchip’s commitment to delivering rugged high-performance solutions for the most demanding power-conversion environments,” said Clayton Pillion, vice president of Microchip’s high-power solutions business unit. “By leveraging our advanced mSiC technology, we’re giving customers a simpler path to building efficient, long-lasting systems across industrial and sustainability markets.”
Microchip offers a broad and flexible portfolio of SiC diodes, MOSFETs and gate drivers.
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Pricing and Availability
The BZPACK mSiC power modules are now available in production quantities. You can purchase directly from Microchip or contact a Microchip sales representative.
