ROHM is taking its GaN power devices game to the next level by integrating its own development and manufacturing expertise with TSMC’s proven process technology.
ROHM Teams Up with TSMC to Build In-House GaN Power Device Production.
ROHM is taking its GaN power device game to the next level by integrating its own development and manufacturing expertise with TSMC’s proven process technology.
Through a new licensing deal, ROHM will bring TSMC’s GaN tech in-house at its Hamamatsu facility, creating a fully integrated production system within the ROHM Group. This move strengthens ROHM’s supply chain to meet surging demand for GaN in AI servers, electric vehicles, and beyond.
GaN devices shine in high-voltage, high-frequency applications, delivering better efficiency and smaller footprints across everything from consumer AC adapters to EV onboard chargers and AI server power supplies. Demand keeps climbing, especially for these industrial heavy-hitters.
ROHM got ahead early, launching mass production of 150V GaN devices at Hamamatsu back in March 2022. For mid-power needs, they’ve leaned on partnerships—like their ongoing work with TSMC, including a 650V GaN process rollout in 2023 and an automotive GaN collaboration sealed in December 2024.
Now, this latest step evolves that partnership further. TSMC’s tech transfer to ROHM Hamamatsu is set to go live in 2027, ramping up capacity right when AI and EV markets need it most. Once complete, the companies will wrap up their automotive GaN deal but keep collaborating on even more efficient, compact power solutions.
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