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Rigaku Unveils XTRAIA MF-3400 for Advanced Chip Metrology

The XTRAIA MF-3400, an instrument used in semiconductor manufacturing processes for measuring wafer thickness and composition, was introduced by Rigaku Corporation. By providing high-accuracy evaluation of materials essential to the the mass production of next-generation memory chips and high-speed AI devices, the XTRAIA MF-3400 will greatly increase productivity in the quickly expanding semiconductor market.

Rigaku Unveils XTRAIA MF-3400 for Semiconductor Metrology

The need for high-performance, energy-efficient semiconductors that can process enormous amounts of data is growing as generative AI and data centers continue to grow. As a result, semiconductor structures are growing increasingly intricate, delicate, and three-dimensional, with billions of microscopic electronic components integrated into a single chip.

Nondestructive technologies that can precisely measure and insulate metal films at the nanoscale are necessary for the stable mass production of these advanced devices.

Rigaku developed the XTRAIA MF-3400 by further advancing the X-ray technology it has developed over decades in order to address this need.

The XTRAIA MF-3400’s new features include the ability to test molybdenum, an element that is gaining attention as a material of the future.

Rigaku Unveils XTRAIA MF-3400 for Semiconductor Metrology
Comparison of output, in wafers per hour (WPH) of MF-3400 with previous generation tool.

Key Features of the XTRAIA MF-3400

  • Measurement capability up to double that of previous devices
    By doubling the X-ray dose and integrating a new transport system, the number of wafers measurable per hour is dramatically increased.
  • Nondestructive measurement with nanoscale accuracy
    On a field as narrow as 50 µm, less than the width of a human hair, the XTRAIA MF-3400 can measure film thickness with sub-nanometer precision finer than the thickness of a single atom.
  • Multiple analyses on a single device
    The XTRAIA MF-3400 incorporates three analytical functions using X-rays: fluorescent X-rays, X-ray reflectance, and X-ray diffraction. Measurement can be automated by registering optimal conditions in recipes, tailored to objectives including ultra-thin-film structure, thickness, or crystallinity.

Track Record and Prospects

Nondestructive technologies that can precisely measure and insulate metal films at the nanoscale are necessary for the stable mass production of these advanced devices.

Rigaku developed the XTRAIA MF-3400 by further advancing theRigaku Unveils XTRAIA MF-3400 for Semiconductor Metrology X-ray technology it has developed over decades in order to address this need. The XTRAIA MF-3400’s new features include the ability to test molybdenum, an element that is gaining attention as a material of the future.

For the XTRAIA MF-3400, a variety of modules designed for various applications are available. Because of this versatility, any manufacturer can create the measurement environment that best suits their production operations.

In order to achieve sustained growth of 20% annually for both model series in FY2027 and beyond, Rigaku will continue to explore applications in new material and process domains by utilizing these capabilities in scalability and adaptability.

To Know More: CLICK HERE

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