“We are deeply grateful for the Government of India’s continued trust in our vision, as we remain committed to driving this upward trajectory and contributing to India’s self-reliance in the global semiconductor ecosystem,” states Prithvideep Singh, CDIL.
Four additional semiconductor projects under the India Semiconductor Mission (ISM) were approved by the Union Cabinet, which is led by Prime Minister Shri Narendra Modi. With six authorized projects now in various phases of execution, momentum is growing in India’s semiconductor ecosystem.
SiCSem, Advanced System in Package (ASIP) Technologies, Continental Device India Private Limited (CDIL), and 3D Glass Solutions Inc. are the four companies whose submissions were accepted today.
With a total investment of approximately Rs. 4,600 crore, these four approved proposals will establish semiconductor manufacturing facilities.
It is anticipated that these facilities will create a total of 2034 skilled jobs, which will stimulate the ecosystem of electronic manufacturing and lead to the creation of numerous indirect jobs.
With these four additional approvals today, there are now ten projects under ISM that have been approved, totaling investments of almost Rs. 1.60 lakh crore across six states.
Given the increased demand for semiconductors in telecom, automotive, datacentres, consumer electronics and industrial electronics, these four new approved semiconductors projects would greatly contribute to building Atmanirbhar Bharat.
In Odisha, SiCSem and 3D Glass will be installed. Punjab is home to CDIL, whereas Andhra Pradesh will host ASIP.
SicSem Private Limited and Clas-SiC Wafer Fab Ltd., UK, are working together to build an integrated facility for compound semiconductors based on silicon carbide (SiC) in Info Valley, Bhubaneshwar, Odisha.
This will be the nation’s first commercial compound factory. The goal of the project is to produce silicon carbide devices.
This compound semiconductor factory will be able to produce 60,000 wafers and 96 million units of packaging annually. Applications for the suggested goods include consumer appliances, fast chargers, data center racks, electric vehicles (EVs), missiles, defense equipment, and solar power inverters.
In Info Valley, Bhubaneshwar, Odisha, 3D Glass Solutions Inc. (3DGS) plans to establish a vertically integrated advanced packaging and embedded glass substrate facility. The most cutting-edge packaging technology in the world will be introduced to India by this unit. The next generation of semiconductor industry efficiency is brought about by advanced packaging.
The facility will feature a wide range of cutting-edge technology, such as 3D Heterogeneous Integration (3DHI) modules and glass interposers with silicon bridges and passives. This machine is expected to produce 13,200 3DHI modules annually, 50 million completed units, and roughly 69,600 glass panel substrates.
Defense, high-performance computing, artificial intelligence, radio frequency and automotive, photonics, co-packaged optics, and other fields would all benefit greatly from the suggested products.
Under a technical partnership with APACT Co. Ltd., South Korea, Advanced System in Package Technologies (ASIP) will establish a semiconductor manufacturing facility in Andhra Pradesh with a 96 million unit capacity per year.
Applications for the manufactured products will be found in automobiles, set-top boxes, cell phones, and other electronic devices.
In Mohali, Punjab, Continental Device (CDIL) plans to increase the size of its discrete semiconductor manufacturing plant.
High-power discrete semiconductor devices, including transistors, MOSFETs, IGBTs, and Schottky Bypass Diodes, will be produced at the proposed facility using silicon and silicon carbide. This brownfield expansion will have an annual capacity of 158.38 million units.
Automotive electronics, including electric vehicles and their charging infrastructure, renewable energy systems, power conversion applications, industrial applications, and communication infrastructure, will all use the devices produced by these suggested units.
Since these projects comprise the nation’s first commercial compound fab and a highly advanced glass-based substrate semiconductor packaging machine, their approval would significantly strengthen the nation’s semiconductor ecosystem.
These will enhance the nation’s developing world-class chip design capabilities, which are being driven by government assistance for design infrastructure given to 278 academic institutions and 72 start-ups.
Over 60,000 kids have already benefited from the talent development programme.
Leadership Comments
Expressing his thoughts, Prithvideep Singh, General Manager, Continental Device India Private Limited (CDIL Semiconductors), said, “For 60 years, CDIL has quietly built the backbone of India’s semiconductor industry. Our Mohali facility, continues its expansion, earlier under the SPECS scheme, and now the ISM approval represents the next major milestone. With this investment, we would expand our installed capacity of 600 million units to over 760 million units annually and sharpen our focus on Silicon and Silicon Carbide chips. We are deeply grateful for the Government of India’s continued trust in our vision, as we remain committed to driving this upward trajectory and contributing to India’s self-reliance in the global semiconductor ecosystem.”
