Sarcina Technology has revealed improvements in its Co-Packaged Optics (CPO) photonic package design capabilities, which tackle the core issues data centers face in handling the exponentially growing volume of data as AI evolves. A new era of high data rate, high bandwidth, and low power interconnects is being made possible by Sarcina’s ground-breaking work in photonic package design.
The performance, power, and density requirements of next-generation data center systems are now beyond the capabilities of conventional copper interconnects. When the signal travels more than a few meters, copper interconnects are no longer sufficient because of the high insertion loss of copper cables.
Because of the increased bandwidth, reduced latency, energy efficiency, space savings, and longer transmission lengths, system architects are now shifting toward optical integration at the package level.
Sarcina’s design approach is rooted in four key disciplines: electrical performance, optical alignment, thermal control and mechanical robustness. Its packaging solutions are carefully architected to achieve:
- High signal integrity under high data rate of transmission
- Power integrity simulation
- Thermal management and mechanical reliability
- Compact optical integration
- Long-term system durability
Sarcina’s design portfolio includes full-package architecture for integrating photonic and electronic components in a single module:
- Silicon Photonics Co-Design: Seamless integration of PICs and ASICs with optimized placement, signal routing and thermal dissipation.
- Opto-Electronic Interface Engineering: Coordinated electrical and optical layout ensuring clean transitions and minimal loss, verified through high-speed signal integrity simulation across package layers and interfaces.
- Multi-Chip Module (MCM) Layout: Architecting packages that bring together ASICs, modulators, drivers, TIAs and passives in the form of bare dice or chiplet, packaged ASICs from various package types and in unified 2.5D or 3D layouts.
- Precision Optical Coupling: Developing alignment strategies and mechanical structures that support micron-accuracy fiber and lens placement within package constraints.
Leadership Comments
According to Larry Zu, CEO at Sarcina Technology: “Our new approach to Co-Packaged Optics removes the long copper trace between the switch and the optical module, replacing it with short, high-integrity connections between ASIC and optics. This is made possible because of our unique package design skills, creating novel layout architectures and integration schemes that directly integrate switch ASICs to photonic ICs inside a package. As the recent rise in AI applications puts more and more pressure on data center systems, the need for this expertise has never been greater.”
Larry Zu concludes: “Sarcina’s expertise in both high-speed electrical packaging and Co-Packaged Optics with Silicon Photonics chiplets sets us apart. This is particularly valuable as the industry shifts toward co-packaged solutions to improve data transmission efficiency and reduce power consumption. By seamlessly integrating multiple ASIC dice with optical components, Sarcina addresses challenges facing data centers that traditional semiconductor or optical companies might struggle with. It’s exciting to see how this kind of cross-disciplinary capability can shape next-generation connectivity and computing solutions.”
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