Due to the growing density of chips in mission-critical applications like medical devices and automotive systems, the semiconductor industry faces testing issues. In response to these issues, Keysight Technologies presents the Electrical Structural Tester (EST), a wire bond inspection solution that guarantees the reliability and integrity of electronic components in semiconductor production.
Efficient Testing of Wire Bond Structural Faults
Costly latent failures are caused by wire bond structural faults, which are frequently missed by current testing procedures. Furthermore, sampling methods commonly used in traditional testing strategies are insufficient in detecting wire bond structural flaws, Keysight EST addresses these challenges.
By utilizing state-of-the-art nano Vectorless Test Enhanced Performance (nVTEP) technology to establish a capacitive structure between the wire bond and a sensor plate, Keysight’s EST solves these testing issues.
By employing this technique, the EST may detect minute flaws such wire sag, near shorts, and stray wires, allowing for a thorough evaluation of the wire bond integrity.
Key Benefits of the Keysight EST include:
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Advanced defect detection: Identifies a wide range of wire bond defects, both electrical and non-electrical, by analyzing changes in capacitive coupling patterns to ensure the functionality and reliability of electronic components.
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High volume manufacturing ready: Enables throughput of up to 72,000 units per hour through the ability to test up to 20 integrated circuits simultaneously, which boosts productivity and efficiency in high-volume production environments.
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Big data analytics integration: Captures defects and enhances yield through advanced methods like marginal retry test (MaRT), dynamic part averaging test (DPAT), and real-time part averaging test (RPAT).
The solution identifies subtle defects such as wire sag, near shorts, and stray wires for comprehensive assessment of wire bond integrity. Advanced capacitive-based test methodology enables superior defect detection.
Keysight EST test platform is high-volume manufacturing-ready, capable of testing 20 integrated circuits simultaneously for throughput of up to 72,000 units per hour.
Key Comments
Carol Leh, Vice President, Electronic Industrial Solutions Group Center of Excellence, Keysight, said: “Keysight is dedicated to pioneering innovative solutions that address the most pressing challenges in the wire bonding process. The Electrical Structural Tester empowers chip manufacturers to enhance production efficiency by rapidly identifying wire bond defects, ensuring superior quality and reliability in high-volume manufacturing.”
To Know More About Electrical Structural Tester (EST): CLICK HERE
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