TECH POLICY
Intel Patents MicroLED Tech for Glass Substrate Chip Packaging
Intel has secured a groundbreaking MicroLED patent that integrates MicroLEDs directly into semiconductor packaging. The innovation leverages glass substrates and Through Glass Vias to deliver...
EPC’s Next-Gen GaN Power Solutions For AI, Robotics, and Space at electronica 2026
As artificial intelligence pushes data center power requirements to their limits, Efficient Power Conversion (EPC) is bringing its latest gallium nitride (GaN) solutions to...
Infineon Launches Major Backend Manufacturing Hub in Bangkok
Infineon Technologies has officially opened the doors to a highly scalable backend semiconductor manufacturing site in Samut Prakan, Bangkok, cementing a critical new hub...
Broadcom-Toppan JV Opens Singapore Fab to Clear AI Substrate Bottlenecks
In a targeted strike against the production bottlenecks stalling the artificial intelligence sector, US chipmaker Broadcom and Japanese manufacturing giant Toppan Holdings have launched...
Teledyne FLIR Secures Industry-First UL 2684 Listing for Thermal Fire Detection Cameras
Teledyne FLIR has landed an industry-first UL 2684 listing for its A40 and A70 (Axx-Series) thermal imaging cameras, officially clearing the hardware for use...
Kosuke Akiyoshi Tapped to Lead Panasonic Industry Europe as Spatz Retires
Panasonic Industry Europe is undergoing a major leadership transition. After more than 27 years with the company and over a decade steering its European...
BOS Semiconductors Joins Arm Ecosystem to Scale Custom Silicon for Physical AI
BOS Semiconductors has joined the Arm Total Design for Physical AI ecosystem. Through its participation, BOS Semiconductors plans to expand its technology and business...
NX Group with ISM to Overhaul India’s Chip Supply Chain Logistics
IPPON EXPRESS HOLDINGS, INC. signed a memorandum of understanding (MOU) lately with the India Semiconductor Mission (ISM), an initiative overseen by the Ministry of...
Navitas Lands ALATTIS Contract to Bridge Critical U.S. Supply Gap in 10 kV SiC Tech
With the ALATTIS program underway, Navitas will now build on that foundation to shatter the 6.5 kV ceiling, securing next-generation 10 kV production entirely...
Resonac Targets 4x Die Yield Boost with Ultra-Large Wafer Format
The two-decade reign of the 300mm silicon wafer might be coming to an abrupt end, and Japan is positioning itself to own the next...
Brandner Targets India-Europe Tech Corridor with New EV Roadmap
H.E. Ashish Kumar Sinha, the Indian Ambassador to Estonia, recently toured Brandner Electronics OÜ’s printed circuit board (PCB) manufacturing facility in Paide.
Polymatech-Backed Brandner Electronics...
