Entegris and Inpria Cross-License EUV Lithography Patents
Entegris and JSR Corporation, the materials innovation company and parent of Inpria Corporation, have announced a non-exclusive cross-licensing agreement designed to help the semiconductor...
Microchip’s 3.3kV mSiC Modules Power Next-Gen AI Data Centers
Microchip Technology just unveiled its new 3.3 kV HV-D3 mSiC power modules, a game-changer for solid-state transformers (SSTs) in AI hyperscale data centers and...
HMS Anybus Communicators Become CRA-Ready for EU Cybersecurity
HMS Networks just made life a lot easier for industrial manufacturers dealing with the EU Cyber Resilience Act (CRA). Its Anybus Communicators are now...
MIKROE Debuts Stepper 29 Click for Smarter, Smoother Motor Control
Stepper 29 Click is MIKROE’s latest addition to its lineup of motor control Click boards, designed to simplify and accelerate embedded development. Built for...
TP-Link India Begins Local Wi-Fi 7 Production, Eyes Exports
TP-Link India has started local production of its Wi-Fi 7 lineup, beginning with the Omada EAP770 enterprise access point, marking a clear push to...
Acoustic Imaging Exposes Hidden Air Loss in Auto Manufacturing
HIKMICRO is highlighting the growing importance of acoustic imaging technology in automotive manufacturing, where hidden inefficiencies in compressed air systems can quietly impact production performance,...