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TVP BUREAU

TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

Rohde & Schwarz RF and microwave Test Solutions at EuMW 2026

When the device under test starts pushing beyond the...

Marelli’s Racing ECUs Take Center Stage at FIM Motorcycle Museum

Marelli is partnering with the FIM Racing Motorcycle Museum...

Panasonic Industry Heat Pump, Refrigeration Solutions at Chillventa 2026

Panasonic Industry is set to showcase its latest solutions...

Tata Elxsi Invests in KAVIA AI to Accelerate Enterprise Software Transformation

Tata Elxsi has made a strategic investment in KAVIA...

Samsung, ASML Expand High NA EUV Partnership for 12-Inch Masks

Samsung Electronics and ASML have expanded their long-running partnership...

MIC Electronics Acquires 59% Stake in Neo Semi

Hyderabad based MIC Electronics has completed the acquisition of...

Toshiba Ramps Up Compact Cortex-M4 MCUs for Single-Motor Control

Toshiba Electronic Devices & Storage Corporation has begun mass production of its TXZ+ Family Entry-Class M4L Group, a new series of compact motor-control microcontrollers...

U.S. Commerce Picks 7 Chip Firms for $874M in CHIPS R&D Bets

The U.S. Department of Commerce on July 29 signed letters of intent to steer $874 million in CHIPS Act incentives to seven companies working...

Design, Fab, Repeat – UoH Students Turn Internship into Real Devices

The Centre for Advanced Studies in Electronics Science and Technology (CASEST) at the School of Physics, University of Hyderabad, has concluded two intensive three-week...

Enphase Energy Publishes White Paper on Kestrel ASIC

Enphase Energy has released a new technical white paper detailing its latest custom silicon platform, the “Enphase Kestrel ASIC,” a purpose-built chip designed to...

Tessolve Ties Up with Intel Foundry for Advanced EMIB Packaging

Tessolve has partnered with Intel Foundry to support advanced package design like EMIB chiplet packaging. Embedded Multi-die Interconnect Bridge (EMIB) has become a key technology...

China’s CXMT Enters ETF Spotlight, Challenging Global Memory Giants

Tema ETFs has added ChangXin Memory Technologies (CXMT) to its Tema Memory ETF (DISK) as a top holding, assigning it a 10.56% portfolio weight....

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