AmpStack 80V MOSFET Squeezes a Full Half-Bridge Into One DFN6x5 Package
Alpha and Omega Semiconductor (AOS) has launched the AOPL66801, an 80V MOSFET in a symmetric half bridge configuration housed in its DFN6x5 AmpStack package,...
Micron Locks in Long-Term Memory Supply for Ford’s Next-Gen Vehicles
Micron Technology and Ford Motor Company have signed a long term Strategic Customer Agreement to lock in automotive memory and storage supply for Ford’s...
MIT Optical Bumps Push Chips to Petabit Speeds
MIT researchers are betting that the next leap in performance will come from putting electronics and photonics side by side inside the same package...
SEMI, GNC Report Flags Glass Core Substrates as Next Big Bet for AI & HPC
SEMI has released a new industry research report on the fast-emerging glass core substrate market, developed in collaboration with Global Net Corp. (GNC). The...
APEM and Alps Alpine Europe Join Forces on Next Gen Industrial HMIs
APEM and Alps Alpine Europe have entered into a strategic partnership to develop next generation human machine interface systems(HMI Systems) for industrial OEMs across...
UoH Boosts Chip Talent With New Semiconductor and VLSI Internships
CASEST at the University of Hyderabad is running dual track internships in VLSI design and semiconductor fabrication, giving students hands on experience with EDA tools, cleanroom processes and device fabrication while feeding into India’s broader semiconductor talent pipeline.