SEMI has released a new industry research report on the fast-emerging glass core substrate market, developed in collaboration with Global Net Corp. (GNC). The Glass Core Substrate Market and Development Trends Report takes a close look at glass core substrates as a potential next-generation packaging technology gaining traction as AI and high-performance computing (HPC) drive demand for larger, more complex semiconductor packages.
The report points to rising activity and investment around glass core substrates as the industry gears up for the next wave of advanced packaging. It offers an independent view of the technology’s market potential, current development status, leading players, and the key hurdles that still need to be cleared before broader commercialization.
Under the report’s market development scenarios, initial production ramps could begin around 2028 in select high-performance applications, gradually expanding into larger and more complex package architectures.
Across its Positive, Base, and Negative outlooks, the report projects an average compound annual growth rate (CAGR) of 67.2% from 2028 to 2040, reflecting the strong growth expectations tied to this emerging segment.
It also charts a rapidly evolving global ecosystem, with companies and research organizations in Asia, North America, and Europe pushing glass core substrate technologies forward.
Key themes in the report include:
- Market outlook and adoption scenarios for glass core substrates
- Technology drivers and barriers to commercialization
- Expected use cases in AI, HPC, advanced processors, co-packaged optics, and image sensors
- Company activities spanning substrates, glass materials, equipment, processing, inspection, and adjacent supply-chain segments
- Development hubs, consortia, and overall supply-chain structure
- Forecast scenarios for glass core substrate markets through 2040
Key Comment
“As chipmakers look for new ways to improve system performance beyond traditional device scaling, advanced packaging has become a critical area of innovation,” said Clark Tseng, Senior Director of Market Intelligence, SEMI. “Glass core substrates are being evaluated as one possible solution for future high-end packages because they may help support larger package sizes, finer interconnects, and improved dimensional stability compared to conventional package-substrate materials. This new report helps industry stakeholders understand where glass core substrates may fit in the next phase of packaging technology and what challenges must be addressed to achieve broader adoption.”
The Glass Core Substrate Market and Development Trends report is available in English and Japanese editions through SEMI Market Intelligence. Download the report.
