Sivers, SemiNex to Power AI Data Center Interconnects
Sivers Semiconductors and SemiNex Corporation announced a program for next-generation InP light sources for AI data center interconnects.
The program is initially valued at approximately...
TI Takes CAN XL Mainstream with New 20 Mbps Industrial Transceiver
Texas Instruments has introduced the TCAN6062, which it describes as the industry’s first commercially available CAN XL transceiver. Designed for industrial systems, the device...
Seoul Viosys Secures India Injunction Following Patent Rulings in Europe and US
Seoul Semiconductor and its affiliate Seoul Viosys have secured a permanent injunction in India against the infringement of their opto-semiconductor patents. The Delhi High...
VIAVI’s New Vertex 6.0 Supports 6G Waveforms, Wi-Fi 7/8 Testing
VIAVI Solutions has launched Vertex 6.0, an enhanced channel emulation platform designed to support testing for next-generation 6G and Wi-Fi 7/8 technologies.
The company says...
Polymatech Fires Up Automated Memory Line for AI Boom
Polymatech Electronics says its newly operational, fully automated memory module manufacturing line positions the company to serve rising demand across high-performance computing, enterprise, industrial...
Applied Materials, UC Berkeley Partner to Advance AI Chip Research
UC Berkeley alumni also work across Applied’s engineering, scientific and management teams, while the company continues to recruit from the campus.
Applied Materials is bringing...