Samsung Electronics and ASML have expanded their long-running partnership to accelerate High-NA EUV lithography and next-generation manufacturing tech aimed at AI-era chips. The expanded deal, announced lately, tightens cooperation on advanced memory and logic processes while backing an industry push to move from 6-inch to 12-inch photomasks.
12-Inch Photomasks: The Next Big Format Shift
For decades, the semiconductor industry has standardized on 6-inch photomasks, but High-NA EUV’s tighter resolution is expected to make larger 12-inch masks more practical and productive.
Samsung will join the industry initiative to advance 12-inch photomask technology, working with partners on mask designs, handling, and the supporting fab infrastructure needed for volume production.
The transition is meant to lift fab productivity, reduce stitching constraints, and lower chipmaking costs as leading-edge nodes scale.
First High-NA EUV in DRAM HVM by 2028
In a first for the industry, Samsung plans to bring ASML’s High-NA EUV lithography into DRAM high-volume manufacturing by 2028.
High-NA EUV’s improved resolution should simplify DRAM process steps, extend the scaling roadmap, and improve efficiency as memory densities climb for AI workloads.
Samsung says the move demonstrates that High-NA technology is ready to support both advanced memory and logic applications.
Aligning Early on High-NA EUV and The 12-Inch Mask Ecosystem
The announcement underscores a shared push to keep Moore’s-law-style gains alive as AI drives demand for more powerful, efficient chips.
By aligning early on High-NA EUV and the 12-inch mask ecosystem, Samsung and ASML are positioning the supply chain to deliver cost-effective, leading?edge devices through the end of the decade.
Exploring Collaboration in Advanced Memory
Samsung and ASML say they will continue exploring collaboration in advanced memory and innovative manufacturing approaches, including further integration of High-NA EUV across product lines.
The companies expect the partnership to remain a core pillar of their roadmaps as the industry prepares for the next wave of AI-driven semiconductor demand.
Leadership Comments
Young Hyun Jun, Vice Chairman & CEO, Samsung Electronics, said: “The AI era is transforming the semiconductor industry and increasing the importance of technological innovation across the entire value chain. Samsung is committed to maintaining leadership in advanced semiconductor manufacturing, including memory and foundry, through breakthrough technologies and strong partnerships. By further strengthening our collaboration with ASML, we are helping lay the foundation for the next generation of AI and semiconductor innovation.”
Christophe Fouquet, President and Chief Executive Officer, ASML, said: “Samsung has been one of ASML’s most important innovation partners for many years. Together, we have helped advance the technologies that underpin modern semiconductor manufacturing. As the industry enters a new era driven by artificial intelligence, close collaboration with our customers becomes even more important. We look forward to working with Samsung to enable the next wave of semiconductor innovation.”
