MacDermid Alpha Electronics Solutions will showcase its latest attach technologies for power electronics at Power Conversion and Intelligent Motion Asia Shenzhen 2026 (PCIM Asia Shenzhen), taking place August 26-28 at the Shenzhen World Exhibition and Convention Center in Shenzhen, China.
At the event, the company will focus on solutions designed to help manufacturers improve attach consistency, thermal performance and production reliability as demand for high-power electronics continues to grow.
The need for reliable attach processes is becoming increasingly important across electric vehicle power modules, telecommunications infrastructure, renewable energy systems, advanced sensing and data center power conversion. As power density rises and switching speeds increase, variations in bond line thickness, voiding, solder volume and interface quality can have a direct impact on system reliability.
MacDermid Alpha Electronics Solutions will demonstrate how its sintering and solder attach portfolio can help manufacturers reduce process variation and achieve more consistent results across production lines and manufacturing locations.
Among the technologies on display will be ALPHA® TrueHeight® Solder Preforms for Power Electronics, which are designed to provide controlled bond line thickness of 75 micrometers or greater for selected power module-to-heatsink assemblies. The preforms also maintain tight length and width tolerances, supporting consistent placement and repeatable solder volume in automated manufacturing processes.
The company will also highlight ALPHA® Argomax® AccuLam™ 8022 silver sintering film for die attach. Available in a 65-micrometer thickness for a 20-micrometer nominal bond line, the film is designed to help standardize the interconnect stack while improving consistency in high-volume power electronics assembly.
The company’s presence at PCIM Asia Shenzhen 2026 comes as manufacturers continue to look for ways to improve process repeatability while meeting the increasingly demanding thermal and reliability requirements of next-generation power electronics.
Visitors to Hall 16, Booth G15 will be able to speak with MacDermid Alpha Electronics Solutions’ technical specialists about current design and manufacturing challenges, explore attach material options and receive application guidance.
Leadership Comment
“Across the market, customers are asking for tighter bond line control, more stable high-volume processes, and assembly solutions that can meet higher thermal demands without adding unnecessary process complexity. Our portfolio expansion addresses those requirements,” said Gustavo Greca, Line of Business Director for Power Electronics at MacDermid Alpha Electronics Solutions.
To Meet The Team During The Show, CLICK HERE
