Entegris and JSR Corporation, the materials innovation company and parent of Inpria Corporation, have announced a non-exclusive cross-licensing agreement designed to help the semiconductor industry push EUV lithography forward for next-generation chip manufacturing.
Under the agreement, the duo will cross-license metal oxide resist (MOR) patents, end the current Inter Partes Review challenge, IPR2025-00267, and look at opportunities to work together on future photoresist materials.
The collaboration is expected to cover everything from resist formulation and precursor synthesis to development, and could even extend to ultra-clean MOR-specific filtration and the delivery systems needed to keep these materials performing consistently in high-volume EUV manufacturing.
By bringing together JSR and Inpria’s strengths in metal oxide resist materials with Entegris’ expertise in MOR precursors for CVD deposition, materials handling, and advanced filtration, the partnership is aimed at strengthening the material base behind semiconductor manufacturing as both companies continue to scale technologies for the AI era.
Leadership Comments
“As the industry moves to smaller nodes, materials innovation, performance, purity, and reliability become inseparable,” said Olivier Blachier, SVP Chief Strategy & Innovation Officer at Entegris. “This cross-licensing reflects how innovation in semiconductors increasingly happens across the ecosystem, helping customers as they adopt next-generation lithography with greater confidence.”
“Pairing Inpria’s metal oxide resist innovation with Entegris’ purification and materials handling capabilities broadens the applicability of these technologies within the semiconductor materials ecosystem,” said Toru Kimura, Senior Officer at JSR Corporation.
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