Aerotech Expands AGV-CPO Laser Scan Head Line for Advanced Micromachining
The AGV-CPO CORE Performance 2-Axis Laser Scan Head was introduced by Aerotech. The AGV-CPO integrates value, precision, and dynamics for a variety of laser...
TOS/Graphene Enables Lossless 2D Phase Modulation
Hybrid tungsten oxyselenide/graphene electrodes that enable nearly lossless optical phase modulation in two-dimensional semiconductor devices have been developed by researchers from Nanyang Technological University,...
Toshiba Powers Up Chip Innovation with Siemens EDA Tools
Toshiba Electronic Devices & Storage Corporation has integrated Siemens' electronic design automation (EDA) software to boost its power device and analog chip development processes....
Can Semiconductors Be Made in Orbit – Here’s What We Know!
Space-based semiconductor manufacturing has taken a major step toward commercial reality as startups and space agencies move from lab experiments to multi-mission pilot production...
Can TI’s New Sherman Fab Really Pump Out Tens of Millions of Chips Daily?
Texas Instruments’ Sherman SM1 facility an exclusive 300mm fab is the first of four planned fabs on the site and
has now started shipping products...
Forlinx New SoM Integrates Rockchip RV1126B with 3?TOPS NPU for Edge AI Computing
The Forlinx FET1126Bx-S integrates a quad-core Arm Cortex-A53 CPU (up to 1.6 GHz commercial / 1.3 GHz industrial) paired with a 3 TOPS NPU...