Tessolve just brought on board Ravi Kumar Chirugudu as President and COO, effective immediately. With over 35 years in semiconductors, silicon systems, embedded software, and product development, Ravi’s a true industry veteran and this move is a smart play to solidify Tessolve’s spot as a global engineering powerhouse in semis and embedded tech.
In his new role, Ravi will drive growth by beefing up global engineering teams, strengthening key customer ties, and pushing innovation in semiconductors and high-performance computing.
He’s got a knack for building high-performing, cross-regional teams and scaling engineering operations worldwide.
The timing couldn’t be better. This comes hot on the heels of Tessolve snapping up Germany’s Dream Chip Technologies and securing $150 million from TPG. Ravi’s expertise will be key as the company expands its global footprint and ramps up across the semiconductor value chain.
Before Tessolve, Ravi held big leadership gigs at HCL Technologies, Altran, and Wipro, running major P&L portfolios. He kicked off his career as an ISRO scientist, working on cutting-edge CCD tech and satellite payloads. Along the way, he’s helped launch over 1,000 new products in high-tech, energy, and manufacturing.
Tessolve’s already a major player in the $550 billion semiconductor market, partnering with 18 of the top 20 chip companies worldwide.
With 3,500+ engineers across 12 countries including India, the US, Germany, the UK, Singapore, and Malaysia the company’s primed to ride the next industry wave with its heavy investments in advanced semis and embedded tech.
Leadership Comments
“As we scale our global semiconductor and system engineering capabilities, Ravi’s appointment marks an important step forward,” said Srini Chinamilli, Co-Founder & CEO of Tessolve. “As global semiconductor demand continues to accelerate across industries, it is creating significant opportunities across the semiconductor lifecycle—from Design, Packaging, Validation and Systems integration. Ravi’s deep knowledge and leadership in this ecosystem brings the right mix of industry expertise, customer connect and execution capability, which will play a key role in strengthening our position as a trusted global engineering partner and reinforcing our market leadership.”
Speaking about his new role, Ravi Kumar Chirugudu, President & COO of Tessolve, said, “I am happy to join Tessolve at a time when the industry is rapidly evolving towards more complex, AI-driven systems. What stands out to me is its strong people-first culture and its commitment to bringing value to its customers. The strength of its global team, combined with its deep expertise in semiconductor innovation and next-generation product engineering, creates a solid foundation to build differentiated, scalable solutions. I look forward to working closely with the team to drive strategic growth and strengthen its role in shaping the global semiconductor ecosystem.”
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