Kyocera Launches Ceramic Core Substrate for AI xPUs, 2.5D Packaging
Kyocera Corporation has announced the commercialization of a new multilayer ceramic core substrate tailored for advanced semiconductor packages, including xPUs and switch ASICs that...
Can Cisco’s New Quantum Switch Connect Multi-Vendor Networks?
Cisco has moved one of the most critical blocks toward a practical quantum network as the company recently unveiled the Cisco Universal Quantum Switch....
VIAVI Announces Major Investment in PCIe 7.0 Protocol Test Platform
Designed to deliver deep, actionable insights, the new Xgig PCIe 7.0 platform builds on the Xgig Software Suite with Trace Control, Expert, and Serialytics.
VIAVI...
Murata’s New AMR Magnetic Sensors Enable Nanoamp AMR Switching
Murata has introduced two ultra-low-power AMR magnetic sensors, the MRMS166R and MRMS168R, for switching functions in battery-powered electronics. Both devices are designed around one of the biggest...
Anglia Signs Pan-European Distribution Deal with Isocom Components
Anglia Components has signed a pan-European distribution agreement with Isocom Components, a leading manufacturer of high-performance infrared optoelectronic devices.
As part of the agreement, Anglia now...
MacDermid Alpha to Unveil Zero-PFAS Die Attach Paste at SEMICON SEA
MacDermid Alpha Electronics Solutions will introduce ATROX® CD 560-1, a zero-PFAS conductive die attach paste, at SEMICON Southeast Asia 2026, taking place from May 5–7...