Tessolve Ties Up with Intel Foundry for Advanced EMIB Packaging
Tessolve has partnered with Intel Foundry to support advanced package design like EMIB chiplet packaging. Embedded Multi-die Interconnect Bridge (EMIB) has become a key technology...
China’s CXMT Enters ETF Spotlight, Challenging Global Memory Giants
Tema ETFs has added ChangXin Memory Technologies (CXMT) to its Tema Memory ETF (DISK) as a top holding, assigning it a 10.56% portfolio weight....
SCTIMST, Tata Elxsi Join Forces to Build Next-Gen MedTech Solutions
Sree Chitra Tirunal Institute for Medical Sciences and Technology (SCTIMST), Thiruvananthapuram, has partnered with Tata Elxsi to jointly develop next-generation healthcare solutions, marking a...
EnerVenue Appoints Rahul Mehta CRO to Scale Battery Business
EnerVenue has appointed Rahul Mehta as Chief Revenue Officer, bringing on board a seasoned commercial leader with over 15 years of experience across global...
NVIDIA, Silvaco Alliance Targets Faster Chip Simulation
Silvaco Group and NVIDIA to push digital twins for semiconductor design and manufacturing to the next level. The companies announced a collaboration that combines...
DOES EVERY AI DEVICE HAVE TO BE CONNECTED TO THE CLOUD?
Just a few years ago, most applications using artificial intelligence were based on a simple operating scheme. Data from sensors went to a server...