Teledyne HiRel Launches Space-Screened LNA for LEO and MEO Satellites
Teledyne HiRel Semiconductors has launched the TDLNA0840SEP, a space-screened, ultra-low-power wideband low-noise amplifier (LNA) built for the exploding demands of LEO and MEO satellite constellations,...
MediaTek, Samsung Hit Industry-First 670 Mbps 5G Uplink
MediaTek and Samsung have achieved a major 5G milestone, successfully completing the industry's first test of a 3Tx 5-layer uplink configuration. Powered by MediaTek's...
CIYES Eyes EV Charging Boom in India
As India’s shift to electric mobility gains momentum, CIYES Systems is positioning EV charging as one of the most compelling infrastructure opportunities for businesses...
Qorvo’s New SOI RF Portfolio to Simplify Wideband Defense System Design
With TTL-compatible control that removes the need for a negative voltage rail, the SOI RF switches, DSAs portfolio streamlines biasing networks, cuts component count,...
NeoCortec NeoMesh Powers Endrich e-IoT with Ultra-Low-Power Mesh
NeoCortec is deepening its industry footprint not just as a distribution partner, but by teaming up with Endrich Bauelemente Vertriebs GmbH to power their...
Kioxia Takes On Samsung with Wafer-Bonding in Memory Chip Showdown
Kioxia Holdings is finally making its wafer-bonding move. The Japanese semiconductor manufacturer is launching a direct challenge to Samsung Electronics' grip on the memory...