GlobalFoundries Readies SLATE for Next-Gen 3D Chip Integration
GlobalFoundries(GF) is pushing deeper into advanced packaging with the production readiness of its SLATE wafer-to-wafer bonding technology, unveiled on June 23. Built on the...
Infineon, LS ELECTRIC Team Up on DC Power for AI Data Centers
Infineon Technologies and LS ELECTRIC have signed a Memorandum of Understanding (MoU) to work together on high-efficiency DC power infrastructure solutions for AI data...
Diraq Proves Eight Qubit Silicon Quantum Chip Can Scale
Diraq has announced another major milestone on its roadmap to utility scale silicon quantum computers with the publication of its latest work, “Eight Qubit...
Kandou AI Plants India Chip Design Flag in Hyderabad
Kandou AI has opened its India semiconductor design centre and national headquarters in Hyderabad, giving a fresh boost to the city’s ambitions in global...
Balancing Innovation and Compliance: How Technology Leaders Can Turn Data Privacy into a Strategic Advantage
Modern technology executives are increasingly challenged by a critical dual mandate: accelerating digital and artificial intelligence (AI) innovation while strictly navigating the requirements of...
Smart Ships Need Smart Infrastructure: Why the Physical Layer Matters More Than Ever
The evolution of smart ships will depend not only on advanced applications and automation technologies but also on the strength of the infrastructure supporting...