SGS’ First Premium Performance Mark to Li Auto’s Cockpit Platform
SGS has announced the first award of its Premium Performance Mark for an automotive cellular communication product, recognizing Li Auto’s L9 Livis 5G high?performance...
Airengy, Nobian Eye 2.5 GWh Compressed Air Storage in Danish Salt Cavern
Airengy has signed a new partnership agreement in Denmark to explore and assess long-duration compressed air energy storage in a Nobian-operated salt cavern with...
Intel Invests €5 Billion to Scale Irish Fab 34
Intel is investing €5 billion to expand semiconductor manufacturing in Ireland, strengthening its European base and underlining the country’s role in the global chip...
Toshiba Boosts Industrial Isolation with Enhanced Digital Isolators
Toshiba Electronic Devices & Storage Corporation has expanded its DCL34xx0B series of quad-channel digital isolators for industrial applications with the addition of four new...
GlobalFoundries Readies SLATE for Next-Gen 3D Chip Integration
GlobalFoundries(GF) is pushing deeper into advanced packaging with the production readiness of its SLATE wafer-to-wafer bonding technology, unveiled on June 23. Built on the...
Infineon, LS ELECTRIC Team Up on DC Power for AI Data Centers
Infineon Technologies and LS ELECTRIC have signed a Memorandum of Understanding (MoU) to work together on high-efficiency DC power infrastructure solutions for AI data...