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To Lead in Advanced Packaging Sector, ASE Establishes New K18B Factory

A groundbreaking ceremony for Advanced Semiconductor Engineering, ASE K18B factory in Kaohsiung, Taiwan, was recently held. The goal of this new facility is to meet the quickly increasing need for high-performance computing (HPC), automotive electronics, and artificial intelligence (AI).

ASE K18B factory in Taiwan for system-in-packaging, CoWoS

The K18B factory is expected to boost innovation and growth in Taiwan while solidifying ASE’s position as the market leader in the advanced packaging sector.

With a NT$17.6 billion investment, the ASE K18B factory is expected to be completed in the first quarter of 2028 and will generate about 20,000 new employment specializing in system-in-packaging and advanced packaging processes (CoWoS).

For CoWoS and Chiplets, this includes Copper Pillar Bumping, FOCoS, and FC BGA, offering customers reliable and efficient solutions.

The ASE K18B Factory Features:

  • VC-B grade anti-vibration design and includes an independent Central Utility Building (CUB) for centralized management of electricity, cooling water, and compressed air systems.
  • Incorporates an intelligent fire evacuation guidance system and an AIoT fire safety inspection system to improve operational safety.
  • In line with ASE’s commitment to sustainability, the new factory will use low-carbon building materials, smart energy management, and recycled water systems, aiming for EEWH Gold certification and a Fire Material Label to establish a low-carbon, eco-friendly smart factory.

According to its official release, ASE’s innovative packaging technology keeps pushing the boundaries of innovation.

The ASE K18B factory strengthens the company’s aim to create a more intelligent, environmentally friendly, and resilient semiconductor ecosystem and represents a significant step in the company’s pursuit of a dual transformation of “advanced × sustainable.”

ASE K18B factory in Taiwan for system-in-packaging, CoWoSThe next generation of sustainable and revolutionary semiconductor solutions is being paved by ASE in close cooperation with partners in Taiwan and throughout the world.

Leadership Comments

“As advanced packaging becomes increasingly vital in the semiconductor value chain, ASE will continue to invest in cutting-edge technologies and equipment to meet the rising global demand for AI and HPC,” said Dr. Mike Hung, Senior Vice President of ASE Kaohsiung. “The establishment of the K18B factory will not only drive local industrial growth but also further strengthen ASE’s strategic position within the global semiconductor supply chain,” he continued.

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TVP BUREAUhttps://thevoltpost.com
TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

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