ROHM has developed new 4-in-1 and 6-in-1 SiC molded modules in HSDIP20 package that are optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs. The lineup includes six 750V models (BSTxxx1P4K01) and seven 1200V products (BSTxxx2P4K01).
All basic circuits necessary for power conversion in various high-power applications are combined into a compact module package, decreasing manufacturers’ design workload and allowing for the shrinking of power conversion circuits in OBCs and other devices.
The SiC molded modules in HSDIP20 package Features:
- An insulating substrate with excellent heat dissipation properties that suppresses the chip temperature rise even during high power operation.
- When comparing a typical OBC PFC circuit utilizing six discrete SiC MOSFETs with top-side heat dissipation to ROHM’s 6-in-1 module under the same conditions, the HSDIP20 package was verified to be approx. 38°C cooler (at 25W operation).
- This high heat dissipation performance supports high currents even in a compact package.
- Achieves industry-leading power density more than three times higher than top-side cooled discretes and over 1.4 times that of similar DIP type modules.
As a result, in the PFC circuit mentioned above, the SiC molded modules in HSDIP20 package can reduce the mounting area by approximately 52% compared to top-side cooled discrete configurations, greatly contributing to the miniaturization of power conversion circuits in applications such as OBCs.
Application Examples
Power conversion circuits like PFC and LLC converters are commonly used in the primary side circuits of industrial equipment, allowing the HSDIP20 to also contribute to the miniaturization of applications in both the industrial and consumer electronics fields.
- Automotive systems
- Onboard chargers, electric compressors and more.
- Industrial equipment
- EV charging stations, V2X systems, AC servos, server power supplies, PV inverters, power conditioners,
Enhancing Power Density, Improving Heat Dissipation
In recent years, the growing electrification of vehicles has fueled efforts to build a decarbonized society. Higher battery voltages in electric vehicles are increasing the cruising range and charging speed, creating a requirement for more output from OBCs and DC-DC converters.
At the same time, there is a growing market demand for greater downsizing and reduced weight for these applications, necessitating scientific advancements to enhance power density, a critical factor, while also improving heat dissipation characteristics, which could otherwise stymie development.
ROHM’s HSDIP20 package addresses technical obstacles that were previously difficult to overcome with discrete configurations, resulting in increased output and downsizing of electric powertrains.
Going forward, ROHM will continue to advance the development of SiC modules that balance miniaturization with high efficiency while also focusing on the development of automotive SiC IPMs that provide higher reliability in a smaller form factor.
Sales Information
- Pricing: $100/unit (samples, excluding tax)
- Availability: OEM quantities (April 2025)
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