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Software-defined automation requires open container architectures
Software-defined automation is transforming industrial operations. Open container architectures decouple software from infrastructure, simplify deployment, strengthen cybersecurity, and create the foundation for scalable, interoperable,...
Zephyr Project Secures Platinum Commitments From TI and Infineon
Texas Instruments (TI) and Infineon Technologies are deepening their investments in the open-source embedded landscape, officially upgrading their memberships in the Zephyr Project to...
Intel Patents MicroLED Tech for Glass Substrate Chip Packaging
Intel has secured a groundbreaking MicroLED patent that integrates MicroLEDs directly into semiconductor packaging. The innovation leverages glass substrates and Through Glass Vias to deliver...
TI’s Entire Embedded Portfolio Now On Zephyr RTOS
Texas Instruments is officially throwing its weight behind the Zephyr Project. The semiconductor giant announced that its entire embedded portfolio, spanning microcontrollers, microprocessors, and...
EPC’s Next-Gen GaN Power Solutions For AI, Robotics, and Space at electronica 2026
As artificial intelligence pushes data center power requirements to their limits, Efficient Power Conversion (EPC) is bringing its latest gallium nitride (GaN) solutions to...
TakeMe2Space Launches Orbital AI Infrastructure with SpaceX Rideshare Mission
TakeMe2Space is getting ready to deploy its MOI-1A satellite aboard SpaceX’s Transporter-18 rideshare mission on October 2, moving edge computing straight into Earth's orbit.
Equipped...
Infineon Launches Major Backend Manufacturing Hub in Bangkok
Infineon Technologies has officially opened the doors to a highly scalable backend semiconductor manufacturing site in Samut Prakan, Bangkok, cementing a critical new hub...
DigiKey Unveils Factory Tomorrow Season 6 on Next-Gen Manufacturing
DigiKey announces the launch of Season 6 of Factory Tomorrow, a video series highlighting how manufacturers and technology suppliers are building the foundation for...
Broadcom-Toppan JV Opens Singapore Fab to Clear AI Substrate Bottlenecks
In a targeted strike against the production bottlenecks stalling the artificial intelligence sector, US chipmaker Broadcom and Japanese manufacturing giant Toppan Holdings have launched...
Teledyne FLIR Secures Industry-First UL 2684 Listing for Thermal Fire Detection Cameras
Teledyne FLIR has landed an industry-first UL 2684 listing for its A40 and A70 (Axx-Series) thermal imaging cameras, officially clearing the hardware for use...
Renesas Debuts Industry-First Dual-Side Cooled 650V GaN
Renesas Tackles AI Data Center Heat with Industry-First Dual-Side Cooled 650V GaN Device.
As AI data centers push rack power limits from 120 kW toward...
