POWER ELECTRONICS
Infineon Unveils OptiMOS 7 40V MOSFETs to Shrink AI Server Power Footprints
Infineon’s latest OptiMOS 7 40V portfolio targets the exact pain point modern data centers, AI servers, and telecom designs face, squeezing higher power density...
Littelfuse Solves Switch Scalability with New Modular, End-Stackable DIP Switches
Littelfuse has launched the C&K SDE Series, a new family of low-profile, surface-mount DIP switches designed to give hardware engineers much-needed flexibility in space-constrained...
AI data centers are trading copper for control
Powering a server used to be a solved problem. For decades, a typical server rack drew 10 to 15 kilowatts from a 48 volt...
Exxelia Readies Rugged Capacitors and Stator Manufacturing Tech for electronica 2026
Exxelia will exhibit at the upcoming Electronica 2026 trade fair in Munich, Germany, from November 10 to November 13, 2026. Technical staff and product...
Renesas Scales Up Capacitive Touch and Power Efficiency in Expanded RL78 Lineup
Renesas is pushing its 16-bit MCU dominance further into the smart home with the launch of the RL78/G21 and an expanded RL78/G23 lineup. Engineered...
Microchip Clears Major Radiation Tests with New RISC V Space Processor
As spacecraft become increasingly autonomous, software-defined, and incredibly data-heavy, the demand for serious onboard processing is skyrocketing. However, that computing power has to survive...
Littelfuse Launches 7 kW Automotive TVS Diodes With Ultra-Low Clamping
Littelfuse has introduced the TP7.0SMD-XC Series of automotive-grade TVS diodes, led by the TP7.0SMD24CA-XC. Built around advanced foldback technology, the series delivers an unusually...
Power Integrations Expands Billion-Unit CAPZero Line with Ultra-Low Power IC
Power Integrations just rolled out the CAPZero-4, the latest addition to their well-known line of X-capacitor discharge ICs. They actually pioneered this technology back...
VW and NXP Forge Strategic Zonal MCU Pact for 2027 SDVs
Ahead of the International Suppliers Fair (IZB) in Wolfsburg, Volkswagen Group and NXP Semiconductors have forged a strategic partnership that lays the physical groundwork...
Rambus, ChipAgents Accelerate Chip Design with Agentic AI
Rambus and ChipAgents are teaming up to push the boundaries of chip design using agentic AI. The partnership is comprehensive as Rambus is rolling...
Navitas Unveils 2300V SiC Modules to Power Next-Gen AI, Grid Infrastructure
Navitas Semiconductor is expanding its ultra-high-voltage (UHV) SiC portfolio with a new line of power modules built specifically to handle the heavy demands of...
