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Valens Powers Barco ClickShare USB-C Extension Kit
Valens Semiconductor has announced that its HDBaseT chipsets will power the connectivity infrastructure in Barco’s ClickShare USB-C Extension over CAT kit. The solution introduces...
VPI Technology Joins Morse Micro Wi-Fi HaLow Design Partner Program
Morse Micro has announced that VPI Technology has joined its Design Partner Program, bringing its full-stack Wi-Fi HaLow design and manufacturing expertise to the...
New Edge AI SoC to Power Smart Cameras for Automotive and Robotics
indie has released the iND881, its next-generation Edge AI SoC designed to power smart cameras for automotive and robotic applications.
By combining AI compute with...
Baya Systems and Openchip Partner for Next-Gen AI Compute
Baya Systems and Openchip have announced a strategic partnership that brings together two teams focused on solving the real bottleneck in next-generation AI and...
ST Kicks Off China Made STM32 Shipments Under Dual Supply Strategy
STMicroelectronics has begun delivering general purpose STM32 microcontrollers manufactured in China, marking a significant step in its global supply chain strategy. The first batch...
MIKROE Spatial Anchor S1 R1 Trackers Enable 6-DoF Motion for Apple Vision Pro
MIKROE announces two spatial accessory tracking modules that mount to simulation rigs, industrial equipment, and basically anything you want Apple Vision Pro to track...
MIKROE Launches LTE Cat.1 5 Click for European IoT Connectivity
MIKROE just launched LTE Cat.1 5 Click, a new cellular wireless connectivity Click board™ designed for developers who need reliable, low-power IoT connectivity in Europe. These...
Forlinx Unveils FET3572-C SoM with 4 TOPS NPU for Edge AI
With growing demand for edge AI and ultra-HD capabilities, the Forlinx Embedded FET3572-C SoM stands out with its 4 TOPS NPU, 8K codec performance, and balanced...
MediaTek, Samsung Hit Industry-First 670 Mbps 5G Uplink
MediaTek and Samsung have achieved a major 5G milestone, successfully completing the industry's first test of a 3Tx 5-layer uplink configuration. Powered by MediaTek's...
NeoCortec NeoMesh Powers Endrich e-IoT with Ultra-Low-Power Mesh
NeoCortec is deepening its industry footprint not just as a distribution partner, but by teaming up with Endrich Bauelemente Vertriebs GmbH to power their...
MIKROE Rolls Out Life Metrics Click for Multi-Vital Wearable Monitoring
Life Metrics Click is MIKROE’s latest addition to its growing lineup of biometrics-focused Click board™ modules, designed to simplify the development of advanced health and wearable applications....