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TVP BUREAU

TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

Responsible Corporate & Social Infrastructure Advisory: UCF’s Gateway to Sustainable Growth of Urban Infrastructure & Clean Energy

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Responsible Corporate & Social Infrastructure Advisory: UCF’s Gateway to...

Anglia Inks Pan-European Deal to Distribute NOVOSENSE Analog, Mixed-Signal ICs

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Anglia Components has signed a Pan-European franchise agreement with...

Littelfuse Launches 7 kW Automotive TVS Diodes With Ultra-Low Clamping

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Littelfuse has introduced the TP7.0SMD-XC Series of automotive-grade TVS...

You’re Invited: Build, Scare, and Win at the element14 Halloween Hackathon

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Spooky season is officially here, and the element14 Community...

Power Integrations Expands Billion-Unit CAPZero Line with Ultra-Low Power IC

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Power Integrations just rolled out the CAPZero-4, the latest...

VW and NXP Forge Strategic Zonal MCU Pact for 2027 SDVs

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Ahead of the International Suppliers Fair (IZB) in Wolfsburg,...
ELECTRONICS

Alchip 3DIC Platform Enables Multi-Tbps AI Stacks

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As AI processor design moves from the chip level to the system level, Alchip Technologies is betting that its 3DIC platform will become a...
VOLT IN

NXP Expands India Blueprint with Proposed Mohali Hub

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NXP Semiconductors is eyeing Mohali, Punjab as a potential new R&D hub in India, as part of its broader bet on the country’s semiconductor...
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Toray Unveils Release-Liner-Free Fabric Adhesive Film

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Toray Industries has developed a fabric adhesive film whose design selectively eliminates the need for a release liner (see note 1). Micron-level protrusions on...
RENEWABLES

Airengy Eyes €51M Solar, Storage and Wind Platform in Poland

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Airengy has announced it has signed documents to examine a series of transactions in the Polish market totaling around €51 million across solar energy,...
VOLT IN

STMicroelectronics Unveils Next-Gen ST64UWB UWB Chips

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STMicroelectronics expands its ultra-wideband focus as the company launches its ST64UWB family. It is said to be the first fully integrated UWB solution that...
VOLT IN

Has Google Inked A Deal With Marvell For Next-Gen AI Inference Chips?

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Google is quietly rewriting its AI hardware playbook by opening discussions with Marvell Technology to co-develop a new generation of AI Inference Chips -...
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