3D Silicon Chip Breakthrough Could Keep Moore’s Law Alive
The team, led by materials science and engineering professor Qing Cao, developed a process that uses ultrathin silicon membranes and low-temperature manufacturing to overcome...
AVILOO Launches Data-Backed EV Battery Warranty in France and Sweden
AVILOO's new EV Battery Warranty is reshaping how used electric vehicles are evaluated and sold. For the first time, an independent battery diagnosis is...
MediaTek Backs TSMC, Intel Advanced Packaging – What It Means?
MediaTek has signaled that it will support advanced chip packaging from both TSMC and Intel, a move that gives customers more flexibility as demand...
Honeywell Unveils Aerospace Spin-Off as HONA, Sets Dual-Company Future
Honeywell has unveiled new brand identities for its automation and aerospace businesses - Honeywell Technologies and Honeywell Aerospace, ahead of their separation into two...
Power Integrations Unveils Compact GaN PSUs for AI Data Centers
Power Integrations has introduced two ultra-compact auxiliary power supply reference designs tailored for 800 VDC AI data centers, where space and efficiency are at...
R&S Clears Hybrid eCall Certification for Next-Gen Vehicle Safety
Rohde & Schwarz has cleared a major milestone as the company announces that it hybrid eCall and Next Generation eCall test solution has successfully...