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TVP BUREAU

TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

TI Breaks EV Current-Sensing Trade-Off With First Multiaxial Coreless Hall Sensor

Texas Instruments (TI) has introduced what it says is...

Taiwan Expo USA 2026 Set to Drive New Taiwan-U.S. Tech and Manufacturing

Taiwan Expo USA 2026 will return to Dallas this...

Baya Systems Expands into Japan to Accelerate AI Chip Design With WeaveIP Fabric

Baya Systems is stepping up its presence in Japan,...

SEMI Taiwan Launches Chip Materials Alliance to Shore Up Local Supply Chains

SEMI Taiwan has rolled out a new semiconductor materials...

GaN power transistors: What 700 V and 100 V PowerGaN bring to power-supply design

Power designs now face the same demands at the...

Critical Manufacturing, UST To Scale MES, AI-driven Mfg Across Southeast Asia

Critical Manufacturing taps UST to scale MES rollouts across...

EVs in Modern Farming – Challenges, Companies, Prospects Bundled!

In this article, we will navigate the Role of EVs in Agriculture, Utility & Cargo Vehicles, Drones and Aerial EVs, Autonomous EVs and Robots,...

Addverb’s Zippy 10 Robots Get Infineon’s Leading BLE Tech

Addverb and Infineon Technologies announce collaboration to address important safety problems. This strategic alliance intends to integrate Infineon BLE-based communication devices into Addverb's robotic...

Next-Gen IoT Devices Powered by New Silicon Labs Wireless SoC Families

Silicon Labs unveiled the SiXG301 and SiXG302, two new wireless SoC families built at the advanced 22 nanometer (nm) process node, as the first products of its...

What Makes Them The Largest Semiconductor Companies in 2025?

In 2025, the semiconductor industry will be a battlefield of innovation, capital, and policy. While TSMC, Samsung, Intel, and NVIDIA dominate by segment, regionally...

Infineon, NVIDIA Developing New Architecture of 800 V HVDC for AI Data Centers

Infineon Technologies claims to be revolutionizing the power delivery architecture required for future AI data centers. In collaboration with NVIDIA and Infineon are developing...

Teledyne FLIR OEM Prism Software Picked by Dragoon for Highly Autonomous Mission

Teledyne FLIR OEM announces Dragoon is utilizing Prism Supervisor and Prism SKR software for AI-driven object detection, tracking, real-time autonomy flight control, and mission planning...

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