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TVP BUREAU

TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

TI Breaks EV Current-Sensing Trade-Off With First Multiaxial Coreless Hall Sensor

Texas Instruments (TI) has introduced what it says is...

Taiwan Expo USA 2026 Set to Drive New Taiwan-U.S. Tech and Manufacturing

Taiwan Expo USA 2026 will return to Dallas this...

Baya Systems Expands into Japan to Accelerate AI Chip Design With WeaveIP Fabric

Baya Systems is stepping up its presence in Japan,...

SEMI Taiwan Launches Chip Materials Alliance to Shore Up Local Supply Chains

SEMI Taiwan has rolled out a new semiconductor materials...

GaN power transistors: What 700 V and 100 V PowerGaN bring to power-supply design

Power designs now face the same demands at the...

Critical Manufacturing, UST To Scale MES, AI-driven Mfg Across Southeast Asia

Critical Manufacturing taps UST to scale MES rollouts across...

Top 10 MEMS Technology Companies in 2025 Toggled!

We chose the Top 10 MEMS Companies in 2025 based on how much revenue they log from MEMS products, their latest innovations and patents,...

ST Lab-in-Fab 2.0 in Singapore to Drive piezoelectric MEMS Tech

The extension of the "Lab-in-Fab" (LiF) in Singapore has been announced by STMicroelectronics in partnership with the A*STAR Institute of Microelectronics (A*STAR IME) and...

New FCU3501 Embedded Computer Flaunts 26+6 TOPS Powerful AI Performance

The Forlinx Embedded FCU3501 Embedded Computer is developed based on the Rockchip RK3588 processor, featuring a 4×Cortex-A76 + 4×Cortex-A55 architecture, with the A76 cores running at up to...

Combining TI Expertise in Power Conversion with NVIDIA for AI Data Centers

Texas Instruments (TI) stated that it is collaborating with NVIDIA to develop sensing and power management technologies that will support NVIDIA's upcoming 800V high-voltage direct...

The Latest Amphenol GEC PowerLok Power Connectors at TME

Amphenol GEC PowerLok power connectors are now part of TME's product line. These new This new PowerLok 4.0 G2 connectors, PowerLok G2 plugs and...

Hongfa Compact Active Suspension Power Design Will Transform Driving

Vicor high-density power modules are used in the Hongfa solution to produce a small (197 x 201 x 71mm) 5kW power supply for every...

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