Paras Defence Enters Semiconductor Race with 3D Packaging Focus
Paras Defence Launches Semiconductor Subsidiary named Paras Semiconductors Private Limited to Advance Chip Packaging for Defence and AI.
Paras Defence and Space Technologies Ltd. has...
Can China’s Ion Implanter Milestone End Import Era?
China unveils POWER-750H ion implanter to boost chip independence. This homegrown equipment is known to target a vital gap in power semiconductor production, matching...
Pickering China Turns 10, Unveils 2026 Strategy
Using a variety of case studies and application use cases, Pickering China additionally outlined its business strategy and platform advantages across both functional and...
X-energy Locks In 10-Year Graphite Supply with SGL Carbon
A 10-year graphite supply contract for X-energy's Xe-100 small modular reactor ("SMR") was announced by X-energy Reactor Company and SGL Carbon. A long-term strategy...
India’s Brightest Innovators Shine in DigiKey’s IoT + AI Design Challenge
The ElectronicWings IoT + AI Project Design Challenge 2025 winners will be revealed by DigiKey. Indian makers and students were asked to submit innovative...
SST, UMC 28nm SuperFlash ESF4 Meets Automotive Grade 1 Standards
Customers looking for a solution, such as providing high-capacity controller firmware that needs over-the-air (OTA) update flexibility, can benefit from SST's SuperFlash ESF4 solution...