The Electronic System Design – ESD industry posted revenue of $5,466.3 million in the fourth quarter of 2025, up 10.3% from $4,955.2 million in the same period a year earlier, according to the ESD Alliance, a SEMI Technology Community, in its latest Electronic Design Market Data (EDMD) report.
The four-quarter moving average also rose 10.1%, reflecting growth compared with the previous four-quarter period.
Companies tracked in the EDMD report employed 71,517 people worldwide in Q4 2025. That was up 13.8% from 62,833 in Q4 2024, though down 2.3% from Q3 2025.
The quarterly report provides detailed revenue data across product and application categories, as well as geographic regions.
Among product categories, Computer-Aided Engineering (CAE) revenue increased 5.0% year over year to $1,887.4 million, while the four-quarter moving average climbed 5.6%. IC Physical Design and Verification revenue fell 2.6% to $777.2 million, and its four-quarter moving average declined 5.1%.
Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 1.8% to $484.6 million, with the four-quarter moving average up 4.5%.
Semiconductor Intellectual Property (SIP) revenue grew 18.3% to $2,083.2 million, while the four-quarter moving average increased 17.4%. Services revenue rose 19.6% to $233.9 million, and its four-quarter moving average was up 15.6%.
By region, the Americas remained the largest market, with $2,473.5 million in ESD product and service procurement in Q4 2025, up 13.9% year over year. The four-quarter moving average for the Americas rose 10.6%.
EMEA recorded $683.4 million, up 9.8%, while its four-quarter moving average increased 9.4%. Japan saw procurement fall 18.8% to $258.5 million, and its four-quarter moving average declined 7.4%. APAC reached $2,050.8 million, up 11.3%, with a four-quarter moving average increase of 12.6%.
The EDMD report, formerly known as the Market Statistics Service, is published quarterly and covers revenue data for the EDA, SIP and services industries. Public and private companies contribute to the report, which is released by SEMI about three months after the end of each quarter.
The report breaks down data by product category, including CAE, IC Physical Design and Verification, SIP, PCB and MCM Layout, and Services, along with several subcategories. It also includes regional revenue data for the Americas, EMEA, Japan and APAC, plus total employment at participating companies.
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