Intel Breaks Ground on New Santa Clara Fab to Power Next-Gen AI Chips
Intel is deepening its Silicon Valley roots with a major new investment in Santa Clara. The company’s foundry arm (Intel Foundry) has broken ground...
SGS Awards Yaoshi World’s First IEC 81001-5-1 Certification
SGS has awarded Yaoshi the world’s first IECEE CB certification under IEC 81001-5-1:2021 for its ultra-widefield scanning laser ophthalmoscope, or SLO, following a detailed...
Keysight and WIN Semiconductors Cut GaN MMIC Tapeout Risk
Keysight and WIN Semiconductors have launched a new joint design workflow that aims to make GaN MMIC development simpler and less risky for high-frequency...
Fujifilm India Plans Semiconductor Materials Facility in Dholera
Fujifilm India has signed a memorandum of understanding with the Gujarat State Electronics Mission to explore the possibility of setting up a semiconductor materials...
Eplan Next Spotlights the Future of Engineering and Automation
Eplan’s first Eplan Next26 conference in Munich brought together around 1,500 attendees from 36 countries for two days of discussion, demos and forward-looking ideas...
Infineon Wins Top Investor Relations Honors in Germany and Europe
Infineon Technologies AG has earned multiple honors for its investor relations work, underscoring the strength of its communication with the capital markets.
At the German...