Asahi Kasei Launches PSPI Film to Advance Panel-Level Packaging
The PSPI film can be used in redistribution layers and as insulating material for package substrates.
Panel-level packaging is quickly gaining traction across the semiconductor...
Comminent, Silicon Labs Deliver 500,000 Wi-SUN Modules for India’s Smart Grid
Comminent’s Wi-SUN modules are powered by Silicon Labs’ EFR32FG28 Wireless SoC, a platform purpose-built for large-scale smart grid and industrial IoT networks.
Comminent, an innovator...
EEPROM at 40 Years: A Popular, Proven Technology Anticipating Developers Memory Needs
EEPROM is a mature NVM technology with important properties for today’s cutting-edge applications. Sylvain Fidelis, Multi-market Business Line Director, Connected Security at STMicroelectronics, the...
Mouser Brings 2026 Technical Roadshow to India’s Design Hubs
Mouser Electronics is inviting design engineers, embedded developers, and technology professionals across India to the Mouser India Technical Roadshow 2026, a hands-on, engineer-focused tour...
ROHM Breaks ESD Trade-Off With Ultra-Low Capacitance, Low-Rdyn Diodes
ROHM has introduced a new family of ESD protection diodes, the RESDxVx series that set a high bar for both ultra-low capacitance and extremely...
Lam Research Expands in Europe with High-Tech Austria Lab
Lam Research is strengthening its presence in Europe with the launch of a new semiconductor R&D Lab in Austria, signaling a deeper push into...